硅钢资料

研究了CSP流程试制50W270高牌号无取向硅钢热轧→常化→冷轧→退火过程中织构的演变.利用电子背散射衍射技术对全流程织构进行测量和分析.发现热轧板织构在厚度方向上存在较大差异,表层主要为铜型、黄铜和高斯织构,1/4层存在微弱的高斯织构和旋转立方织构,中心层以γ纤维织构和旋转立方织构为主,还含有较弱的α纤维织构.与热轧板相比,常化板表层和1/4层织构变化不大,中心层旋转立方织构和α纤维织构增强.冷轧板各层均具有α纤维织构和γ纤维织构.与冷轧板相比,成品板各层中α纤维织构基本消失,还出现了立方织构和高斯织构. This article focuses on texture evolution in 50W270 high-brand non-oriented silicon steel produced by CSP in hot rolling,normalizing,cold rolling,and annealing processes.The texture in the whole process was measured and analyzed by electron back-scatter diffraction.It is found that the texture along the thickness direction in hot-rolled strips changes obviously;there are mainly copper,brass,and Goss textures in the surface layer;the 1/4 layer has weak Goss texture and rotating cube texture;γ-fib... 

研究了冷轧大压下量,950℃退火时间对一种新型含铜无取向电工钢晶粒度和织构的影响。结果表明,大压下量冷轧,随压下量的增加,退火晶粒向γ线聚集,形成强{111}<112>织构。提高冷轧压下率,退火织构{111}<100>,{110}<001>强度减弱,增加退火时间,退火织构{111}<110>,{100}<001>,{110}<001>强度变弱。采用87.5%冷轧压下率和950℃退火60 s,有利织构{100},{110}占有率最大。 The effect of annealing(950 ℃) time with high cold rolling reduction on grain size and texture of a new non-oriented electrical steel containing copper was investigated.The results show that for high cold rolling reduction,most annealed grains are oriented along γ-fibre with increasing cold rolling reduction ratio and strong texture {111}<112> is formed.With increasing the cold rolling reduction ratio,the intensity of annealed texture {111}<110>,{011}<100> decreases.With increa... 

利用本钢技术中心试验厂技术手段,并与北京钢铁研究院合作,试制了用作家电用电机、微电机、小电机或部分中型电机铁芯的冷轧无取向电工钢。试制钢硅含量小于0.5%,钢板表面平滑,公称厚度0.5mm,且厚度均匀偏差小,性能测定结果表明,产品的磁性能、力学性能满足其使用要求。 BX STEELTechnology Center pilot plant using technical means,and with Beijing Iron and Steel Research Institute,trial cold rolled non-oriented electrical steel that has been used as appliance motor core,micro motor core,small motor core,or part of the medium-sized motor core。Trial steel of silicon content is less than 0.5%,steel plate surface is smooth,the nominal thickness of 0.5mm,and the thickness deviation is small,performance measurement results show that the magnetic properties,mechanical p... 

借助电子背散射(EBSD)技术对AlN为主抑制剂的Hi-B取向硅钢常化工艺的中间冷却制度进行了研究。结果表明:常化后试样均发生了完全再结晶,在60℃/s冷速下组织最均匀;在合适的冷却制度下常化板表层保留了强的Goss织构,它深入到1/4厚度处,并且形成对Goss织构有利的强{554}<225>织构。 The intermediate cooling system of Hi-B oriented silicon steel with AlN main inhibitor in normalizing process was studied by means of electron back diffraction(EBSD) technique. The results show that:the specimens after normalizing are fully recrystallization, and the microstructure is most uniform under the intermediate cooling rate of 60℃/s; under suitable cooling system, normalized plate surface retains strong Goss texture, it penetrates into the 1/4 thickness of the plate and forming strong {... 

为了解决在纹理背景下冷轧硅钢表面缺陷的分割问题,提出了基于局部信息结构张量和活动轮廓模型的硅钢表面缺陷分割方法。将图像的局部信息引入到结构张量中;在结构张量提取的特征空间中,以KL距离作为区域的概率密度相似性度量建立分割图像的活动轮廓模型;采用Split-Bregman数值解法对模型进行求解。运用提出的分割方法对硅钢表面的一些常见缺陷如纵向划伤、横向划伤、异物和孔洞等进行分割实验。实验结果表明,该方法可以准确地分割出硅钢表面缺陷区域,验证了该方法的有效性。 In order to address the segmentation problem for cold rolled silicon steel surface defect based on the texture background,a novel method based on structure tensor and active contour model is proposed.Image local information is introduced to the structure tensor.In the extracted feature space of structure tensor,KL distance is treated as a regional similarity measure of the probability density to establish active contour model for image segmentation.The numerical solution of Split-Bregman is used... 

观察了取向硅钢极薄带经冷轧至不同厚度,并经过不同工艺热处理后的显微组织及亚结构。结果表明:冷轧压下量越大,显微组织中位错密度越高,冷变形组织越多,等轴晶粒越少;增加冷轧压下量可以使试样的再结晶温度降低,当钢带厚度为0.08 mm时,在650℃退火时就能发生明显的再结晶。 Microstructure and substructure of the grain oriented ultra-thin silicon steel sheets is analyzed,which are rolled down to different thickness and treated with different heat treatment process.The result shows that there are higher dislocation density,more cold deformation structure and less equiaxed crystal grain in microstructure of the steel sheets with more cold rolled reduction.Increase of cold rolled reduction will decrease recrystallization temperature,and when thickness of the steel shee... 

对无取向硅钢炼钢全流程钢液增钛的原因进行了分析,认为铁水钛含量、转炉出钢温度、转炉下渣量、精炼渣TiO₂含量、钢水罐及RH浸入管混钢种生产是影响钢液增钛的主要原因。通过采取低钛铁水冶炼,减少转炉下渣量,提高出钢温度,添加白灰改质精炼渣等措施,均能够降低钢液中的钛含量。 After analyzing the causes leading to increased content of titanium in molten nonoriented silicon steel during whole steelmaking process, it was concluded that such factors as content of titanium in hot metal, tapping temperature from converter, quantity of roughing slag entered into the ladle from converter, content of TiO₂ in refining slag, molten steel ladle car,carrying out the steelmaking of different steel grades by the same ladle and same RH immersion tube were the main causes ... 

【作者】 陶永根； ...

结合实际生产0.4%Si无取向硅钢，统计了不含Sn和0.025%Sn无取向硅钢的磁性能变化，利用金相显微镜、X射线衍射仪观察分析不同成分下试样的显微组织和微观织构。试验结果表明：Sn元素可以显著降低无取向硅钢的晶粒尺寸，0.025%Sn试样的平均晶粒尺寸比不含Sn减小28.4%;加入Sn元素后抑制了无取向硅钢中不利于磁性能的{111}面织构组分强度，提高了对磁性能有利的{100}面织构组分强度，0.025%Sn与不含Sn相比磁感均值从1.756 T提升至1.768 T,铁损均值从5.476 W/kg降低至5.204 W/kg,明显改善了无取向硅钢磁性能。 In this paper combined with the actual production of 0.4% Si non oriented silicon steel, the magnetic properties of non oriented silicon steel without Sn and 0.025% Sn were counted. The microstructure and microtexture of samples with different compositions were observed and analyzed by metallographic microscope and X-ray diffraction. The results show that: Sn can significantly reduce the grain size of non oriented silicon steel, and the average grain size of 0.025% Sn sample is 28.4% smaller tha... 

【摘要】 <正>由西电集团、保定天威集团使用迁钢公...

【作者】 朱凤泉； 黄生银； ...

采用CVD法制备6.5%Si高硅钢,介绍了具体的制备工艺过程,研究了温度对渗硅速率和试样质量减轻的影响,同时分析了扩散时间对高硅钢中硅分布的影响。结果表明:在CVD反应过程中,反应温度高于1050℃将大大提高渗硅速率,但当温度大于1200℃后,渗硅速率趋于稳定;渗硅后,试样会减轻、减薄,随着温度升高,试样质量减轻的速率逐渐增大,在1200℃左右趋于稳定;扩散时间越长,硅分布越均匀,结合制备效率进行考虑,满足Δw表-中/b≤5的时间为适宜的扩散时间。 6.5%Si high silicon steel was manufactured by using CVD method and the process was introduced,the influence of temperature on the siliconizing rate and quality reducing rate,diffusion time on silicon distribution were investigated.Results as follows: the siliconizing rate will increase quickly when the temperature is higher than 1050 ℃,but the siliconizing rate will become steadily as the temperature up to 1200 ℃;The quality reducing rate will increase with the elevating of temperature and the r...