钢厂
热轧卷取时间对新型冷轧无取向电工钢组织和性能的影响
研究了热轧卷取时间对无取向电工钢晶粒组织、织构演变、铁损和磁感的影响。结果表明,成品晶粒尺寸在120~140μm之间,随卷取时间的增加,成品晶粒尺寸增大。成品织构主要由γ纤维、а纤维和高斯织构等构成。随着保温时间的增加,{111}<110>和{112}<110>织构强度降低。随卷取时间的增加,成品P1.5降低。热轧板最佳的卷取工艺为550℃保温2~3 h,电工钢的综合磁性能优良。 The effects of hot-rolling coiling time on microstructure,texture,core loss and magnetic induction of a new cold-rolled non-oriented electrical steel containing copper were investigated.The test results showed that for final product the grain sizes are 120-140um,with the increase of coiling time,the grain size increase.For final product there are mainly γ-fibre,а-fibre,and {110}<001> texture,Coiling at 550℃ for hot rolled plate,the {111}<110>,{112}<110> texture was weaked with ...
电工钢热压缩时动、静态再结晶组织及取向分析
采用热模拟方法及EBSD技术,研究Fe-3 wt%Si电工钢在不同温度下组织的动、静态再结晶及晶粒取向特征,特别是少量奥氏体对铁素体动、静态再结晶组织及取向的影响。结果表明,不同温度形变的组织主要分三类:形变长条铁素体、珠光体和等轴细小铁素体。长条形变铁素体内发生动态回复或连续式的动态再结晶,奥氏体周围的铁素体动态再结晶加速,部分以传统的不连续方式动态再结晶。铁素体、奥氏体都可发生静态再结晶。奥氏体的静态再结晶在1050℃以上明显,铁素体的静态再结晶随温度的升高逐渐进行,最显著的再结晶发生在1050℃。不同温度形变的样品,其形变晶粒取向主要以<111>和<100>为主,小等轴铁素体晶粒除与大形变铁素体取向相近外,出现了<110>取向及其它取向。 Static and dynamic recrystallization and grain orientations in a hot-compressed Fe-3 wt% Si electrical steels were studied at different temperatures using Gleeble simulator and EBSD technique,particularly focusing on the effect of small amount of austenite on ferritic microstructure and orientations.The results show that microstructure of the compressed steel,depending on deformation temperature,consisted of elongated and deformed ferrite,pearlite and fine equal-axed ferrite.The elongated ferrit...
基于GTN损伤模型对含边部缺陷硅钢薄板冷轧时边裂的预测
采用拉伸试验和显微组织观测的方法确定了GTN损伤模型中的9个损伤参数,运用GTN损伤模型对冷轧硅钢薄板边部缺陷的扩展及边裂的产生进行了有限元模拟,并与预置缺口的钢板轧制试验进行对比。结果表明:轧制过程中边部缺陷是造成钢板边部裂纹萌生和扩展的一个重要原因,GTN损伤模型可用来预测含边部缺陷硅钢薄板在冷轧过程中边裂的产生;预测结果与试验结果基本一致。 The crack initiation and propagation of silicon steel strip with edge defect during cold rolling process was studied by using GTN damage model in this paper.Nine damage parameters in GTN model were identified by tensile testing and microstructure observing,and then the FE simulation of edge defect evolution of silicon steel strip during rolling process was conducted on the base of GTN damage model,and then the results were compared with rolling experimental results.The results show that the edge...
低温普通取向硅钢高温退火过程中高斯晶粒的演变
对低温加热工艺生产的普通取向(common grain-oriented,CGO)硅钢的高温退火过程进行了中断实验,材料为含3.0%Si、0.5%Cu、0.009 8%S(均为质量分数)的以Cu2S为主抑制剂的普通取向CGO钢。原始板坯厚度为230 mm,于1 200℃均热后经4道次粗轧、7道次精轧至2.3mm;热轧板采用两次冷轧法轧至0.3mm,中间完全脱碳退火,最后于1 200℃高温退火。最后样品的磁性能:铁损P17/50为1.182W/kg,磁感应强度B8为1.897T。借助配有EDAX OIM电子背散射衍射(EBSD)系统的ZEISS SUPRA 55VP扫描电子显微镜,对高温退火过程中高斯晶粒的演变进行了研究,结果表明:升温过程中晶粒尺寸增长缓慢,650℃时取向分布函数(ODF)图出现高斯织构组分,但强度很弱,高斯晶粒偏离角小于9°;950℃时高斯晶粒平均生长速度超过其他晶粒;950~1 000℃时高斯晶粒异常长大,偏离角降至约3°;在950℃之前高斯取向晶粒相比于其他晶粒没有尺寸优势。 The high-temperature annealing process of common grain-oriented(CGO)silicon steel was investigated by interrupting test.The samples were rolled from CGO silicon steel slab under low reheating temperature.The CGO silicon steel,taking Cu2S as the main inhibitor,contains3.0%Si,0.5%Cu,and 0.0098%S.The original casting slab is 230mm in thickness.After 1 200℃reheating,four-pass rough rolling and seven-pass finish rolling were conducted to make the thickness of the slab get to 2.3mm.Then the hot rolled...
电脉冲对取向硅钢凝固组织的影响研究
对取向硅钢熔融态钢液进行处理,对比研究了不同脉冲参数的作用效果。结果表明,电脉冲对钢锭晶粒组织具有明显的细化作用,凝固组织等轴晶比例大幅上升。在脉冲电容、频率、处理时间和电压中,影响等轴晶比例的最显著性因素为脉冲频率;最优正交实验参数为:电容1 200μF,脉冲频率1 Hz,处理时间5 s,脉冲电压800 V;随着输入能量的增大,等轴晶率先增大后减小,脉冲输入能量为某值时,等轴晶率最大,通过经典形核理论和热力学对这一现象进行了解释。 Research on the influence of the electric pulse on the solidification structure of oriented silicon steel was preformed.Electric pulses in different parameters were applied to molten steel and results were compared.The result shows that solidification structure of oriented silicon steel can be improved by the electric pulse,and the equiaxed crystal ratio increases obviously.Among the four parameter factors of electric capacity,frequency,applied time and voltage,the most effective factor is frequ...
冷轧工艺对取向硅钢初次再结晶织构的影响
研究了取向硅钢制备过程中常见的两种冷轧工艺,主要研究了一阶段冷轧与两阶段冷轧+中间退火工艺对初次再结晶组织及织构的影响.结果表明:采用两阶段冷轧+中间退火工艺制备以Cu2S为主抑制剂的取向硅钢,其初次再结晶平均晶粒尺寸为18.1μm,高斯晶粒的体积分数为0.6%,迁移性强的重位点阵晶界(Σ5+Σ9)和高能晶界(20°~45°取向偏差角)所占比例分别为1.8%和50.4%.与一阶段冷轧工艺相比,其初次再结晶晶粒较细,且高斯晶核与特征晶界所占的比例较高,有利于高斯晶粒发生二次再结晶. Two common cold-rolling processes of grain oriented silicon steel and the effects of the single stage cold rolling and tw o-stage cold rolling w ith intermediate annealing processes on the primary recrystallization microstructure and texture w ere investigated. The results revealed that for the grain oriented silicon steel prepared under the tw o-stage cold rolling process w ith intermediate annealing w ith Cu 2 S as the main inhibitor,the average grain size of the primary recrystallization micr...
温度及扩散时间对CVD法制备高硅钢的影响
采用CVD法制备6.5%Si高硅钢,介绍了具体的制备工艺过程,研究了温度对渗硅速率和试样质量减轻的影响,同时分析了扩散时间对高硅钢中硅分布的影响。结果表明:在CVD反应过程中,反应温度高于1050℃将大大提高渗硅速率,但当温度大于1200℃后,渗硅速率趋于稳定;渗硅后,试样会减轻、减薄,随着温度升高,试样质量减轻的速率逐渐增大,在1200℃左右趋于稳定;扩散时间越长,硅分布越均匀,结合制备效率进行考虑,满足Δw表-中/b≤5的时间为适宜的扩散时间。 6.5%Si high silicon steel was manufactured by using CVD method and the process was introduced,the influence of temperature on the siliconizing rate and quality reducing rate,diffusion time on silicon distribution were investigated.Results as follows: the siliconizing rate will increase quickly when the temperature is higher than 1050 ℃,but the siliconizing rate will become steadily as the temperature up to 1200 ℃;The quality reducing rate will increase with the elevating of temperature and the r...
剪切方式对冷轧无取向硅钢边部磁畴的影响
为提高无取向硅钢导磁性能,研究了不同剪切方式对无取向硅钢剪切处磁畴结构的影响。利用纳米磁流体观测无取向硅钢剪切后边部磁畴结构。结果表明,硅钢无论在机械剪切还是线切割后的边部磁畴都会发生不同程度的改变:线切割对边部磁畴结构改变较小,边部磁畴分布均匀且连续,在距边缘0~20μm范围内出现磁畴宽度变小现象;机械剪切对磁畴的改变较为严重,剪切处磁畴零乱且不连续,在距边缘20μm处仍难以观察到完整的磁畴结构。 The effects of different shearing modes on magnetic domain structure of cold rolled non-oriented silicon steel are studied in this paper.The magnetic domain of cold rolled non-oriented silicon steel is observed by nanometer magnetic fluid pattern method.The results show that the edge magnetic domain structure will be changed by mechanical shear and wire-electrode cutting,the variation of edge magnetic domain structure wire-electrode cutting edge is very small,the magnetic domain structure is wel...

