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对碳-锰-硅钢进行不同配分温度的Q&P(Quenching and Partitioning)处理,测试了热处理后不同钢的力学性能和残余奥氏体含量,并用扫描电子显微镜和透射电镜观察其显微组织,分析了配分温度对显微组织和力学性能的影响。结果表明:试验钢显微组织基本由低碳板条状马氏体、块状铁素体和条状残余奥氏体组成;随配分温度的升高,试验钢的抗拉强度呈下降趋势,伸长率与奥氏体含量的变化趋势相同,但变化规律不确定;提高锰含量能稳定残余奥氏体,从而提高试验钢的伸长率,并使伸长率对配分温度不敏感。 The C-Mn-Si steel was quenched and partitioned at different partitioning temperatures,the mechanical properties and residual austenite contents were investigated,the microstructure was observed by SEM and TEM,and the effect of partitioning temperature on microstructure and mechanical properties was analyzed.The results show that the microstructure of the tested steel consisted of lath martensite with low carbon,nubby ferrite and banded residual austenite.The tensile strength of the tested steel ... 
2011-09-28 180 5.8

分析总结退火工艺各参数对冷轧无取向硅钢磁性能的影响,结合设计和生产实践经验介绍退火工艺中各参数的实际生产取值,并针对现生产工艺过程中出现的典型问题提出解决办法。 It is analyzed and summarized the great influences on magnetism of cold rolled non-oriented silicon steel affected by various annealing process data in this article.The relevant settled ways is raised.According to the actual value presetting ways for various annealing process data based on design and production,as well as typical problems occurred during production. 
2012-05-28 174 5.8

本文以热轧常化板为初始材料,采用二次冷轧法与三次冷轧法制备了0.1 mm厚的取向硅钢薄带,测定相应的磁性能,并通过EBSD取向成像技术检测了二次冷轧法与三次冷轧法各工艺过程中织构与组织演变规律。结果表明,采用最终冷轧压下率适中的三次冷轧法,能在冷轧至0.1 mm时保存较多的高斯晶核,使得高温退火后的磁性能明显优于二次冷轧法。最终冷轧压下率通过影响脱碳退火后样品中的{111}<112>织构组分及Goss晶粒数量对最终二次再结晶产生重要影响。 Grain-oriented silicon steel sheets with a thickness of 0. 1 mm were produced from hot-rolled and normalized sheets by two-step-rolling and three-step-rolling methods. Their magnetic properties were measured,and the textures were detected by EBSD technique. The results show that the three-step-rolling method,which has a moderate reduction rate of final cold rolling,can maintain more { 110} < 001 >nucleus,and thus obtaining better magnetic properties compared with the two-step-method. The f... 
2013-04-28 174 5.8

结合硅钢退火炉项目中应用PDSOFT软件进行三维配管设计的案例,描述PDSOFT软件的应用过程,总结其使用要点,分析其优缺点,并提出了推广三维设计软件的思路,对今后PDSOFT在相似项目中的推广应用有参考和借鉴价值。 Combining the case of using PDSOFT software to design the three-dimensional piping,the application process of the PDSOFT software is described,the using points are summarized,the advantages and disadvantages are analyzed,and the ideas of promoting the three-dimensional design software are put forward,which have a strong reference value for the promotion and application of PDSOFT in similar projects in the future. 
2014-04-28 137 5.8

利用电子探针面分析、状态分析及电子背散射衍射相分析技术研究硅钢高温氧化铁皮的显微结构。电子探针面分析可以直观的看出元素的分布状态,初步判断氧化铁皮的结构,而状态分析可以准确表征常规氧化铁皮中铁元素的状态,对于合金元素富集区域则通过电子背散射衍射相分析技术来标定。结果表明,高温氧化铁皮的结构主要有4层,即最外层为厚度约为10μm的Fe2O3相,次外层为Fe3O4相,中间层为FeO相上分布有颗粒状的Fe3O4相,最内层为FeO相和Si元素富集的Fe2SiO4相。其中Fe2SiO4层的分布特征与加热温度密切相关:1 100℃时,Fe2SiO4相呈颗粒状,弥散分布在FeO层;1 200℃时,Fe2SiO4相呈液态,侵入基体和疏松的FeO层,且沿着FeO晶界呈网状分布。 The microstructure of high temperature oxide scale on silicon steel was characterized by electron probe microanalyzer(EPMA)mapping analysis,state analysis and electron backscatter diffraction(EBSD)phase analysis.The element distribution and the initial structure of the oxide scale could be detected by EPMA mapping analysis apparently.And the state of iron in the conventional oxide scales could be determined by state analysis.Meanwhile,the alloy-rich region could be identified by EBSD phase analy... 
2014-10-28 224 5.8

针对不同牌号的无取向硅钢产生结疤缺陷的难易程度和表面结疤缺陷的外形特征及分布规律,分析了该缺陷产生的原因。通过调整剪前导板的对中度,设置精轧侧导板开度余量及短行程数值,及时修补与更换侧导板,减少带坯与侧导板挤撞程度,有效地降低了结疤缺陷发生率。 This article analyses the cause of the scab defects according to the defects appearance characters and distribution law,degree of difficulty to form scar of non-oriented silicon steel. It can effectively decrease the scabs by different methods,such as adjusting the center line of guide plate,setting the opening margin and short stroke value of the side guide on finishing mill,timely repairing and replacing of side guide,decreasing the collision between the strip and side guide. 
2014-03-28 189 5.8

【作者】 程志明; ...
2014-06-28 150 5.8

研究了热处理工艺(退火温度、保温时间、冷却方式)对含Mn的Fe-6.5wt%Si高硅钢热轧带的显微组织及硬度的影响。结果表明,退火温度对Fe-6.5wt%Si合金的组织和显微硬度均有较大影响,随退火温度升高,平均晶粒尺寸和显微硬度均明显增大。小于1 h退火时,晶粒长大缓慢,而长时间(>1 h)退火时,一些次表层晶粒将发生异常长大。水冷组织比空冷组织略细小,但水冷显著降低了显微硬度。Mn含量提高能抑制850℃退火时晶粒的长大,并且促进退火后高硅钢的软化。 The influences of heat treatment process(annealing temperature,heating time,cooling methods) on the microstructure and microhardness of Fe-6.5wt%Si high silicon steel containing manganese for hot rolled strip were studied.The results show that the annealing temperature has a great effect on the microstructure and microhardness of Fe-6.5wt%Si alloy,and as the annealing temperature increases,the average grain sizes and microhardness will significantly increase.When annealing time for less than 1 h... 
2023-05-12 1.45k 5.8

针对某厂DMS森吉米尔轧机生产无取向硅钢表面麻面缺陷的问题,根据生产实际,对其形成原因从乳化液及工作辊两方面因素进行了分析。结果表明:乳化液对麻面缺陷的产生有一定影响,但不是主要因素,主要原因是由于二十辊森吉米尔轧机工作辊辊径较小,轧制相同长度带钢轧辊运转周期较大,容易产生疲劳失效而导致。为此,提出通过调整冷轧工序成品轧制道次的压下率以减小轧制力,从而减小工作辊的磨损疲劳;通过对轧制乳化液浓度、温度的合理控制,以改善润滑效果、提高轧制速度,而进一步缓解轧辊疲劳的改进措施,使该钢厂无取向硅钢麻面缺陷发生率由原来的18%降至0.8%,带钢表面质量明显改善。 For the problem of surface pockmarks of non-oriented silicon steel strip produced by a DMS Sendzimir mill, based on the production practice, the formation causes were analyzed from two aspects of emulsion and working roll. The results show that the emulsion has a certain effect on the formation of surface pockmarks defects, but it is not the main factor. The main reason is that the working roll diameter of the 20-high Sendzimir mill is small, and the running period of the roll rolling the same l... 
2022-01-28 207 5.8

【作者】 朱传芳; 潘恒韬; ...
2023-05-11 308 5.8

【作者】 O.M.Гбанов; A.E.Чеглов; ...
2014-03-28 131 5.8

采用CVD法制备6.5%Si高硅钢,介绍了具体的制备工艺过程,研究了温度对渗硅速率和试样质量减轻的影响,同时分析了扩散时间对高硅钢中硅分布的影响。结果表明:在CVD反应过程中,反应温度高于1050℃将大大提高渗硅速率,但当温度大于1200℃后,渗硅速率趋于稳定;渗硅后,试样会减轻、减薄,随着温度升高,试样质量减轻的速率逐渐增大,在1200℃左右趋于稳定;扩散时间越长,硅分布越均匀,结合制备效率进行考虑,满足Δw表-中/b≤5的时间为适宜的扩散时间。 6.5%Si high silicon steel was manufactured by using CVD method and the process was introduced,the influence of temperature on the siliconizing rate and quality reducing rate,diffusion time on silicon distribution were investigated.Results as follows: the siliconizing rate will increase quickly when the temperature is higher than 1050 ℃,but the siliconizing rate will become steadily as the temperature up to 1200 ℃;The quality reducing rate will increase with the elevating of temperature and the r... 
2013-01-28 186 5.8

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