硅钢资料

在实验室模拟CSP工艺条件下制备了取向硅钢,研究了二次冷轧中间退火工艺对组织和织构的影响。结果表明,中间退火温度对取向硅钢脱碳,高温退火组织及织构均产生明显影响。经940℃中间退火后,取向硅钢脱碳再结晶晶粒较850℃中间退火的多,且再经高温退火处理后,晶粒粗化,最大晶粒尺寸达4.8 mm;高斯织构组分密度达27.00,较850℃中间退火试样高。 Grain-oriented silicon steel was prepared by simulated CSP technology in laboratory. Effects of secondary cold-rolled intermediate annealing on microstructure and texture were studied. The results show that intermediate annealing has obvious effects on the microstructure and texture of the steels after decarburization annealing and high temperature annealing. After intermediate annealing at 940 ℃,recrystallized grain of decarburization annealed steel is more than that of intermediate annealed at... 

为了解决目前冷轧产线硅钢现有切边技术存在的微裂纹、应力、毛刺和边浪等问题,采用光纤激光器进行了高速切割实验,对激光功率、切割速度、激光模式等影响因素进行了分析,同时对高速切割时的切割前沿形状进行了研究。结果表明,切割最高速度随着功率的增加而增加;随着离焦量的增加,切割质量下降,挂渣增多,切缝宽度增加,切割深度变浅;基模激光器能量密度更高,所以薄板切割时的切割速度高于多模激光器;切割前沿随着切割速度的增加会变得平缓,速度足够大时,切割前沿甚至接近与切割方向平行,此时切缝下部存在挂渣现象。 In order to solve the problems such as micro crack,stress,burr,edge waves and so on,existing in cold rolling production line of silicon steel side cutting,experimentsof high speed laser cutting using fiber laser were carried out.Laser power,cutting speed,laser mode and other factors were analyzed,at the same time,cutting front geometries were studied.The results show that the maximum speed increases with power.And the increases of defocus result in poor quality,wider kerf and shallowerkerf.Energ... 

研究了激光加热辅助圆盘剪高速切割技术,以解决现有冷轧生产线硅钢切边技术存在的微裂纹、应力、毛刺和边浪等问题。建立了激光加热温度场有限元分析模型,根据生产线上圆盘剪加工的实际过程,探讨了数值模拟中热源的加载形式,研究了激光对板材进行辅助加热时各个工艺参数如激光功率、光斑尺寸以及激光入射角度对切割工艺的影响,并通过实验对工艺参数进行了优化。最后,进了验证实验。实验结果显示:当激光加热点运动至圆盘剪刃口位置时,温度为100℃左右,此时材料硬度降低到原有硬度的70%~80%,降低了切削力,减少了圆盘剪的磨损,可有效提高圆盘剪的寿命。 Laser assisted trimmer side cutting technology was studied to overcome the problems such as micro cracks,stress,burrs and edge waves existing in a cold rolling production line of silicon steel side cutting.A finite element analysis model for the laser hearting temperature field was established, the loading form of a heating source was determined and influences of various processing parameters like laser powers,spot sizes,and laser incident angles on laser assisted heating sheet materials were di... 

基于BOF→RH→CSP生产工艺,研究了RH精炼过程钢中夹杂物类型演变及MgO·Al2O3夹杂物形成规律,同时对MgO·Al2O3夹杂物的形成条件进行了热力学计算,借助CFD数值模拟软件研究了RH精炼过程卷渣行为。研究发现,RH精炼过程20和30 min时,w([MgO])/w([Al2O3])为0.005~0.020,未发现MgO·Al2O3夹杂物;RH出站后夹杂物w([MgO])/w([Al2O3])为0.3~0.5,且RH精炼结束后MgO·Al2O3夹杂物占夹杂物总量的58.4%;另外,RH精炼过程钢液表面速度CFD模拟结果为0.57 m/s,大于临界卷渣速度0.45 m/s,且顶渣成分与夹杂物成分相近,存在卷渣现象。热力学计算表明,钢液与炉渣平衡时钢中w([Al])为0.31%~0.37%,w([Mg])为0.00024%~0.00028%,在MgO·Al2O3生成区域之内。减少RH处理过程卷渣,浇铸过程下渣及控制顶渣和包衬相中MgO质量分数可抑制MgO·Al2O3夹杂物形成。 Based on the practical production of non-oriented silicon steel, the evolution of inclusion type and the formation of MgO·Al2O3inclusion were analyzed in the process of BOF→RH→CSP. The thermodynamic conditions for forming MgO·Al2O3inclusion were discussed and the behavior of slag entrapment of molten steel was also simulated by CFD software during RH refining. The results showed that the value of w([MgO])/w([Al2O3]) was in the range of 0.005-0.020 and no MgO · Al2O3 inclusion was observed at 20 ... 

取向硅钢利用析出物作为抑制剂,抑制初次再结晶晶粒的长大,抑制剂是取向硅钢发生二次再结晶的基本条件之一。文中通过低温板坯加热技术制备取向硅钢,采用透射电镜(TEM)观察并研究了高温退火阶段抑制剂的演化过程。结果表明,渗氮后形成的非晶态Si3N4析出物不稳定,在700～750℃退火升温阶段转化为(Al,Si)N;(Al,Si)N颗粒在800℃发生团聚,随后长大并粗化;(Al,Si)N是低温取向硅钢主要抑制剂,随退火温度的升高,(Al,Si)N抑制力大幅下降。 Precipitates as inhibitor are used to inhibit the grain growth of primary recrystallization in grain-oriented silicon steel,and inhibitor is one of the basic conditions for occurring of secondary recrystallization.The grain-oriented silicon steel was produced by low temperature slab heating and nitriding technique.The evolution of inhibitor was observed by transmission electron microscopy.The results show that Si3N4 particles are precipitated after nitriding,and Si3N4 particles are amorphous and... 

介绍了国内、外电工钢极薄带的生产现状及市场应用的情况,以及典型生产企业的生产规模、产品性能和应用领域,指出扩大高牌号无取向电工钢生产、提高产品质量是目前电工钢发展的迫切要求。 The production situation and market application of ultra thin electrical steel strip at home and abroad were described.The production capability,product property and application area of typical corporation were introduced.The results indicate that the urgency needed of electrical steel development is expanding high-grade non-oriented electrical steel production and improving products quality at present. 

针对某厂DMS森吉米尔轧机生产无取向硅钢表面麻面缺陷的问题，根据生产实际，对其形成原因从乳化液及工作辊两方面因素进行了分析。结果表明：乳化液对麻面缺陷的产生有一定影响，但不是主要因素，主要原因是由于二十辊森吉米尔轧机工作辊辊径较小，轧制相同长度带钢轧辊运转周期较大，容易产生疲劳失效而导致。为此，提出通过调整冷轧工序成品轧制道次的压下率以减小轧制力，从而减小工作辊的磨损疲劳；通过对轧制乳化液浓度、温度的合理控制，以改善润滑效果、提高轧制速度，而进一步缓解轧辊疲劳的改进措施，使该钢厂无取向硅钢麻面缺陷发生率由原来的18%降至0.8%,带钢表面质量明显改善。 For the problem of surface pockmarks of non-oriented silicon steel strip produced by a DMS Sendzimir mill, based on the production practice, the formation causes were analyzed from two aspects of emulsion and working roll. The results show that the emulsion has a certain effect on the formation of surface pockmarks defects, but it is not the main factor. The main reason is that the working roll diameter of the 20-high Sendzimir mill is small, and the running period of the roll rolling the same l... 

分析了冲裁硅钢芯片时出现的质量问题,针对影响硅钢芯片冲裁质量的4大因素——人、原材料状态、工艺和工装进行了工艺试验和分析,根据原材料状态的差异,采用不同工艺方案,特别是如何合理选择冲裁模具间隙,解决了硅钢芯片冲裁时产生的主要质量问题,使冲裁的硅钢芯片达到最佳质量状态,并满足硅钢芯片的使用性能。 The problems occurred during silicon steel chip punching and the factors that affect the quality of silicon steel chip punching were analyzed,the factors include 4aspects,that is,people,raw material status,process and frock,at the same time,process tests and analysis aimed at the factors that affect punching quality were did,according to the difference of raw material status,corresponding process schedules wee taken,especially in how to reasonably select punching dies clearance,which solved the ... 

阐述了影响硅钢卷材下料利用率的因素,并结合具体事例利用计算机排样系统进行了详细分析,对提高硅钢卷材的利用率具有一定的指导作用。 It describes the factors influenceing the the utilization ratio of the roll of Silicon steel,and analyzes it in detail combined with concrete examples by a computer arrangement system,which can give a guide for increasing the utilization ratio of the roll of Silicon steel. 

【摘要】 <正>据武钢股份公司提供的消息,武钢将与...

利用电子探针面分析、状态分析及电子背散射衍射相分析技术研究硅钢高温氧化铁皮的显微结构。电子探针面分析可以直观的看出元素的分布状态,初步判断氧化铁皮的结构,而状态分析可以准确表征常规氧化铁皮中铁元素的状态,对于合金元素富集区域则通过电子背散射衍射相分析技术来标定。结果表明,高温氧化铁皮的结构主要有4层,即最外层为厚度约为10μm的Fe2O3相,次外层为Fe3O4相,中间层为FeO相上分布有颗粒状的Fe3O4相,最内层为FeO相和Si元素富集的Fe2SiO4相。其中Fe2SiO4层的分布特征与加热温度密切相关:1 100℃时,Fe2SiO4相呈颗粒状,弥散分布在FeO层;1 200℃时,Fe2SiO4相呈液态,侵入基体和疏松的FeO层,且沿着FeO晶界呈网状分布。 The microstructure of high temperature oxide scale on silicon steel was characterized by electron probe microanalyzer(EPMA)mapping analysis,state analysis and electron backscatter diffraction(EBSD)phase analysis.The element distribution and the initial structure of the oxide scale could be detected by EPMA mapping analysis apparently.And the state of iron in the conventional oxide scales could be determined by state analysis.Meanwhile,the alloy-rich region could be identified by EBSD phase analy... 

对CSP流程生产的无取向电工钢M50W800不同尺寸样品的磁性能进行了测试和分析,结果表明:采用不同单片检测的磁性能结果与标准的Epstein方圈样品检测对比,存在明显的偏差;且同一尺寸的单片纵横向样品之间相比较,对应的磁性能差异性也较大。几种不同尺寸的单片样品,以320mm×30mm尺寸的纵横向平均值最接近标准Epstein方圈样的性能值,其铁损偏差最小。 The magnetic properties of M50W800 non-oriented electrical steel produced by CSP process were tested and analyzed with samples of different sizes,showing that significant deviation existed compared to that of Epstein square circle sample.In particular,obvious difference in magnetic properties also existed between longitudinal and transverse samples of the same size.For test samples of different sizes,the average magnetic properties of 320mm×30mm samples are the closest to that of Epstein square ...