论文

【摘要】 <正>2014年5月9日,从武钢硅钢事业部获悉,...

利用场发射扫描电镜观察了以MnS为主要抑制剂的普通取向电工钢加工过程中第二相粒子的分布状态,统计了粒子面密度、平均尺寸以及相应的尺寸分布.结果显示,热轧加工造成了大量第二相粒子弥散、细小地析出,同时基体仍保持过饱和状态.冷轧变形会造成第二相粒子的回溶行为,而基体的过饱和状态会减弱回溶现象.中间退火与脱碳退火过程中会同时存在新粒子的形核及已析出粒子的粗化两个过程,而在最终二次再结晶升温阶段则以第二相粒子明显粗化为主. The distribution of second phase particles in conventional grain-oriented electrical steels during manufacturing processes with MnS as inhibitors was observed by field emission scanning electron microscopy,while the areal particle density,the average particle size and the corresponding size distribution were statistically determined.It is indicated that hot rolling leads to dispersive precipitation of a large amount of fine second phase particles and the matrix keeps a supersaturated state furth... 

运用电子背散射衍射(EBSD)技术,研究了50W600无取向硅钢在热轧→冷轧→退火工序间织构的演变。结果表明:由于热轧板沿板厚方向的应力场和温度场存在差异,导致热轧板不同层织构类型和强度存在差异;热轧板表层主要存在铜型、黄铜和高斯织构,1/4层织构主要为α纤维织构和较弱的高斯织构,中心层织构较单一,主要为α纤维织构;和热轧板相比,冷轧板各层织构差异较小,为典型的轧制织构(α纤维织构和γ纤维织构);退火板各层都表现为γ纤维织构增强、α纤维织构减弱,旋转立方织构基本消失。 The texture evolution of 50W600non-oriented silicon steel in hot rolling,cold rolling and annealing process was investigated by electron back-scatter diffraction(EBSD)technology.Results show that the hot rolled plate texture types and intensities along thickness direction were different because of the different stress fields and temperature fields.The major texture types in the surface of hot rolled plate were copper,brass and Gauss texture.The texture was composed ofαfibre texture and weaker Ga... 

采用EBSD技术研究了有、无拉应力作用下无取向硅钢在晶粒长大过程中织构转变及晶界变化的规律。结果表明:在晶粒生长期间,无应力作用下的硅钢中,{111}〈112〉,{111}〈110〉织构组分强化,而{100}〈001〉织构组分弱化;与无拉应力作用下的情况相比,施加5MPa的拉应力时,{111}〈112〉,{111}〈110〉织构组分强化的速率下降,{100}〈001〉织构组分变化不明显。对于在晶粒生长期间持续变化的{111}〈112〉,{111}〈110〉和{100}〈001〉织构组分而言,虽然有、无拉应力作用下硅钢的{111}〈112〉和{111}〈110〉织构组分的高取向差角度晶界频率均下降,而{100}〈001〉织构组分的高取向差角度晶界频率则上升,但当有拉应力作用后,{111}〈112〉和{111}〈110〉织构组分的高取向差角度晶界频率下降的速率变小,{100}〈001〉织构组分的高取向差角度晶界频率上升的速率稍有变小。通过对无取向硅钢在晶粒长大过程中织构转变及晶界变化规律的研究,分析了合金原子在晶界的偏聚行为。 The rules of texture and grain boundary transformation in the nonoriented silicon steel under applied stress or without applied stress during grain growth were investigated by EBSD.The results show that the {111}〈112〉 and {111}〈110〉 components in the nonoriented silicon steel without stress are strengthened during grain growth whereas {100}〈001〉 component is weakened,but the growth rate of {111}〈112〉 and {111}〈110〉 component decreases,while the area fraction of {100}〈001〉 component doesn’t chang...