论文

叠片系数是冷轧无取向电工钢的重要质量指标。为了提高叠片系数,必须保证无取向电工钢板形良好以及横向厚差小。针对攀钢冷轧厂4机架HC轧机轧制无取向电工钢的边部减薄问题,以无取向电工钢横向厚差最小作为目标函数,建立了一套针对无取向电工钢边部减薄控制的辊型曲线优化数学模型,开发了无取向电工钢专用辊型曲线,使无取向电工钢横向厚差从25μm降低到10μm以下,取得了良好的控制效果。 The lamination factor is an important quality index of non-oriented silicon steel strip.Considering the lamination factor,the non-oriented silicon steel must have a good shape and a smaller transverse thickness difference.In order to solve the edge thinning of non-oriented silicon steel strip in Panzhihua Steel,a mathematic model for designing the roll shape is built.In the model,the transverse thickness difference of non-oriented silicon steel strip is taken as the objective function.Based on t... 

运用EBSD和光学显微镜,研究了0.25%~0.45%Cu对无取向电工钢热轧板显微组织,成品板显微组织、织构和磁性能的影响。实验结果表明:卷取过程中Cu元素在热轧板表层的偏聚作用显著阻碍了热轧板表层再结晶晶粒长大,导致热轧板表层晶粒尺寸随着Cu含量增加而逐渐较小,但热轧板中间晶粒尺寸变化不大。同时发现Cu元素能够明显改善织构类型,使有利织构组分增加,不利织构组分减少,同时减弱织构强度。从实验结果可知0.35%Cu能够显著改善电工钢的磁性能,铁损P15/50最低达到4.1 W/kg,磁感B50最高值达到1.8 T。 Effects of high content Cu on microstructure of hot rolled plates and microstructure,texture and magnetic properties of annealed finish product plates of non-oriented electrical steel were examined by means of EBSD technique and optical microscope. The results show that surface segregation of Cu significantly hindered recrystallized grain growth of surface layer in hot rolled plate during the coiling,as a result,the surface grain sizes of the hot-rohed plates decrease with the increase of Cu con... 

利用OM、TEM与EDS技术,对Fe-3.2%Si低温取向硅钢热轧板进行不同常化冷却工艺处理后的显微组织、析出相及最终产品的磁性能进行分析,并与热轧板的组织和析出相进行对比。结果表明,常化板较热轧板的表层组织均匀,基体中再结晶比例增加,带状组织变窄;常化板中析出物的数量明显比热轧板的多,析出物主要有AlN、MnS及复合析出的(Cu,Mn)S等。在常化温度1120℃、保温3 min的条件下,采用二段式冷却较空冷、淬沸水、淬常温水的冷却工艺,常化板表层显微组织更均匀,沿板厚方向的显微组织的不均匀性显著,取向硅钢的磁性能最高;常化后采用二段式冷却工艺析出的细小析出物数量最多,且弥散分布在基体中,抑制剂的抑制效果最好,对成品获得高磁性最有利。 Microstructure, precipitate and magnetic characteristic of final products with different normalizing cooling processes for Fe-3.2%Si low-temperature hot-rolled grain-oriented silicon steel were analyzed and compared with the hot-rolled plate by optical microscopy(OM), transmission electron microscopy(TEM), and energy dispersive spectrometry(EDS). The results show that, the surface microstructure is uniform, the proportion of recrystallization in matrix increases, and the banding textures are nar... 

采用EBSD技术研究了有、无拉应力作用下无取向硅钢在晶粒长大过程中织构转变及晶界变化的规律。结果表明:在晶粒生长期间,无应力作用下的硅钢中,{111}〈112〉,{111}〈110〉织构组分强化,而{100}〈001〉织构组分弱化;与无拉应力作用下的情况相比,施加5MPa的拉应力时,{111}〈112〉,{111}〈110〉织构组分强化的速率下降,{100}〈001〉织构组分变化不明显。对于在晶粒生长期间持续变化的{111}〈112〉,{111}〈110〉和{100}〈001〉织构组分而言,虽然有、无拉应力作用下硅钢的{111}〈112〉和{111}〈110〉织构组分的高取向差角度晶界频率均下降,而{100}〈001〉织构组分的高取向差角度晶界频率则上升,但当有拉应力作用后,{111}〈112〉和{111}〈110〉织构组分的高取向差角度晶界频率下降的速率变小,{100}〈001〉织构组分的高取向差角度晶界频率上升的速率稍有变小。通过对无取向硅钢在晶粒长大过程中织构转变及晶界变化规律的研究,分析了合金原子在晶界的偏聚行为。 The rules of texture and grain boundary transformation in the nonoriented silicon steel under applied stress or without applied stress during grain growth were investigated by EBSD.The results show that the {111}〈112〉 and {111}〈110〉 components in the nonoriented silicon steel without stress are strengthened during grain growth whereas {100}〈001〉 component is weakened,but the growth rate of {111}〈112〉 and {111}〈110〉 component decreases,while the area fraction of {100}〈001〉 component doesn’t chang...