论文

研究了激光加热辅助圆盘剪高速切割技术,以解决现有冷轧生产线硅钢切边技术存在的微裂纹、应力、毛刺和边浪等问题。建立了激光加热温度场有限元分析模型,根据生产线上圆盘剪加工的实际过程,探讨了数值模拟中热源的加载形式,研究了激光对板材进行辅助加热时各个工艺参数如激光功率、光斑尺寸以及激光入射角度对切割工艺的影响,并通过实验对工艺参数进行了优化。最后,进了验证实验。实验结果显示:当激光加热点运动至圆盘剪刃口位置时,温度为100℃左右,此时材料硬度降低到原有硬度的70%~80%,降低了切削力,减少了圆盘剪的磨损,可有效提高圆盘剪的寿命。 Laser assisted trimmer side cutting technology was studied to overcome the problems such as micro cracks,stress,burrs and edge waves existing in a cold rolling production line of silicon steel side cutting.A finite element analysis model for the laser hearting temperature field was established, the loading form of a heating source was determined and influences of various processing parameters like laser powers,spot sizes,and laser incident angles on laser assisted heating sheet materials were di... 

【作者】 刘彤； ...

介绍了EB5325涂层液的主要性能和中冶新材生产冷轧无取向电工钢所用的涂层设备,通过多次试验摸索出使用EB5325涂层液的工艺,对涂层出现的缺陷进行分析研究,并提出解决方法,使中冶新材生产的冷轧无取向电工钢的涂层质量满足了用户的要求。 This article introduces the main properties of EB5325 and the coating equipments for cold-rolled non-oriented electrical steel. A process using EB5325 coating liquid is made through many time experiments and exploration. The appeared defects in the coating are studied and analyzed,and the solutions are proposed. The coating quality meets clients’ requirements of cold rolled non-oriented electrical steel. 

试验研究了球刻痕法对高磁感取向硅钢的铁损、矫顽力、相对磁导率、巴克豪森噪声等磁学性能的影响.研究结果表明:经过球刻痕处理后,高磁感取向硅钢的铁损明显降低,矫顽力下降,8 mm球刻痕过后铁损值与矫顽力分别下降16.2%和14.7%,且铁损和矫顽力均随刻痕间距降低而减少.刻痕后的高磁感取向硅钢磁导率在高磁感应强度下明显上升,刻痕后巴克豪森噪声值明显降低,经过对比分析确定8 mm为球刻痕的最佳刻痕间距.从磁畴观察、细化磁畴的原理等方面解释了细化磁畴对高磁感取向硅钢性能的影响原因. The effects of the ball scribing on magnetic properties of high permeability grain-oriented silicon steels,including the iron loss,coercive force,relative permeability,and Barkhausen noise were investigated. The results showed that the iron loss and coercive force of the high permeability grain-oriented silicon steels apparently decreased 16. 2% and 14. 7% respectively after 8 mm ball scribing and they both decreased with the decrease of the scribing spacing at the same magnetic flux density. At...