钢厂
冷轧产线硅钢激光高速切边实验研究
为了解决目前冷轧产线硅钢现有切边技术存在的微裂纹、应力、毛刺和边浪等问题,采用光纤激光器进行了高速切割实验,对激光功率、切割速度、激光模式等影响因素进行了分析,同时对高速切割时的切割前沿形状进行了研究。结果表明,切割最高速度随着功率的增加而增加;随着离焦量的增加,切割质量下降,挂渣增多,切缝宽度增加,切割深度变浅;基模激光器能量密度更高,所以薄板切割时的切割速度高于多模激光器;切割前沿随着切割速度的增加会变得平缓,速度足够大时,切割前沿甚至接近与切割方向平行,此时切缝下部存在挂渣现象。 In order to solve the problems such as micro crack,stress,burr,edge waves and so on,existing in cold rolling production line of silicon steel side cutting,experimentsof high speed laser cutting using fiber laser were carried out.Laser power,cutting speed,laser mode and other factors were analyzed,at the same time,cutting front geometries were studied.The results show that the maximum speed increases with power.And the increases of defocus result in poor quality,wider kerf and shallowerkerf.Energ...
硅钢芯片冲裁工艺分析与对策
分析了冲裁硅钢芯片时出现的质量问题,针对影响硅钢芯片冲裁质量的4大因素——人、原材料状态、工艺和工装进行了工艺试验和分析,根据原材料状态的差异,采用不同工艺方案,特别是如何合理选择冲裁模具间隙,解决了硅钢芯片冲裁时产生的主要质量问题,使冲裁的硅钢芯片达到最佳质量状态,并满足硅钢芯片的使用性能。 The problems occurred during silicon steel chip punching and the factors that affect the quality of silicon steel chip punching were analyzed,the factors include 4aspects,that is,people,raw material status,process and frock,at the same time,process tests and analysis aimed at the factors that affect punching quality were did,according to the difference of raw material status,corresponding process schedules wee taken,especially in how to reasonably select punching dies clearance,which solved the ...
