钢厂
表面机械研磨/异步轧制无取向硅钢薄带的渗硅行为
对w(Si)=3%无取向硅钢进行表面机械研磨处理(SMAT)和异步轧制(CSR),获得表面纳米结构,再进行550～650℃、4 h固体粉末渗硅处理,用透射电镜(TEM)、扫描电镜(SEM)和X射线衍射仪(XRD)研究表层组织演变。结果表明:经过SMAT后,w(Si)=3%无取向硅钢表面形成了等轴状、取向呈随机分布的、晶粒尺寸为10 nm的纳米晶组织;异步轧制后,表面纳米晶组织保持不变;550～650℃、4 h渗硅处理后,SMAT+CSR样品表面形成化合物层,其厚度随着温度的升高由17μm增加到52μm;化合物层由Fe3Si和FeSi相组成. Nanostructured surface layer was fabricated on a 3%(mass fraction) non-grain oriented silicon steel by means of surface mechanical attrition treatment(SMAT) and cross-shear rolling(CSR),and then a solid powder siliconizing treatment was carried out for the SMAT+CSR sample at 550~650 ℃ for 4 h.The microstructural evolution was examined by using transmission electron microscopy(TEM),scanning electron microscopy(SEM) and X-ray diffraction(XRD).Experimental results show that: equiaxed nanocrystallin...
高Cu无取向电工钢的制备
运用EBSD和光学显微镜,研究了0.25%~0.45%Cu对无取向电工钢热轧板显微组织,成品板显微组织、织构和磁性能的影响。实验结果表明:卷取过程中Cu元素在热轧板表层的偏聚作用显著阻碍了热轧板表层再结晶晶粒长大,导致热轧板表层晶粒尺寸随着Cu含量增加而逐渐较小,但热轧板中间晶粒尺寸变化不大。同时发现Cu元素能够明显改善织构类型,使有利织构组分增加,不利织构组分减少,同时减弱织构强度。从实验结果可知0.35%Cu能够显著改善电工钢的磁性能,铁损P15/50最低达到4.1 W/kg,磁感B50最高值达到1.8 T。 Effects of high content Cu on microstructure of hot rolled plates and microstructure,texture and magnetic properties of annealed finish product plates of non-oriented electrical steel were examined by means of EBSD technique and optical microscope. The results show that surface segregation of Cu significantly hindered recrystallized grain growth of surface layer in hot rolled plate during the coiling,as a result,the surface grain sizes of the hot-rohed plates decrease with the increase of Cu con...
无取向电工钢边部减薄控制技术研究
叠片系数是冷轧无取向电工钢的重要质量指标。为了提高叠片系数,必须保证无取向电工钢板形良好以及横向厚差小。针对攀钢冷轧厂4机架HC轧机轧制无取向电工钢的边部减薄问题,以无取向电工钢横向厚差最小作为目标函数,建立了一套针对无取向电工钢边部减薄控制的辊型曲线优化数学模型,开发了无取向电工钢专用辊型曲线,使无取向电工钢横向厚差从25μm降低到10μm以下,取得了良好的控制效果。 The lamination factor is an important quality index of non-oriented silicon steel strip.Considering the lamination factor,the non-oriented silicon steel must have a good shape and a smaller transverse thickness difference.In order to solve the edge thinning of non-oriented silicon steel strip in Panzhihua Steel,a mathematic model for designing the roll shape is built.In the model,the transverse thickness difference of non-oriented silicon steel strip is taken as the objective function.Based on t...
冷轧工艺对取向硅钢初次再结晶织构的影响
研究了取向硅钢制备过程中常见的两种冷轧工艺,主要研究了一阶段冷轧与两阶段冷轧+中间退火工艺对初次再结晶组织及织构的影响.结果表明:采用两阶段冷轧+中间退火工艺制备以Cu2S为主抑制剂的取向硅钢,其初次再结晶平均晶粒尺寸为18.1μm,高斯晶粒的体积分数为0.6%,迁移性强的重位点阵晶界(Σ5+Σ9)和高能晶界(20°~45°取向偏差角)所占比例分别为1.8%和50.4%.与一阶段冷轧工艺相比,其初次再结晶晶粒较细,且高斯晶核与特征晶界所占的比例较高,有利于高斯晶粒发生二次再结晶. Two common cold-rolling processes of grain oriented silicon steel and the effects of the single stage cold rolling and tw o-stage cold rolling w ith intermediate annealing processes on the primary recrystallization microstructure and texture w ere investigated. The results revealed that for the grain oriented silicon steel prepared under the tw o-stage cold rolling process w ith intermediate annealing w ith Cu 2 S as the main inhibitor,the average grain size of the primary recrystallization micr...
薄板坯连铸连轧生产中低牌号无取向硅钢的实践
本文中简要介绍了武汉钢铁有限公司采用薄板坯连铸连轧CSP(compact strip production, CSP)工艺生产中低牌号无取向硅钢的实践情况.CSP工艺生产的硅钢具有成品磁性均匀、板形好的优势，但是在利用该技术生产中低牌号无取向硅钢时，常存在成品板表面瓦楞状缺陷严重、连铸生产效率低等问题.通过优化炼钢成分、热轧等相关工艺，可消除热轧板厚度方向中心的粗大形变组织，从源头上避免了粗大{100}<011>纤维组织的出现，消除了瓦楞状缺陷；通过提升冶炼效率和控制钢中夹杂物总量，可优化隧道炉的加热温度与在炉时间，大幅度提升了连铸生产效率，实现了中低牌号无取向硅钢的批量稳定制造，使CSP产线成为中低牌号无取向硅钢热轧板原料的主要供给生产线.如何进一步提升钢水纯洁度、提高连铸生产效率、降低生产成本，以及挖掘该产线生产薄带钢的技术优点，是未来工作的重点. This paper briefly introduces the practice of producing medium and low grade non oriented silicon steel(NGO) with CSP(compact strip production, CSP)technology in Wuhan Iron and Steel Co., Ltd.. This technology has the inherent advantages of uniform magnetic properties and good shape for silicon steel finished strip. However, in the actual production process, there are serious corrugated defects on the surface of silicon steel finished strip, and production efficiency of continuous casting is low...
奥氏体化温度对高碳含硅钢等温转变的影响
采用XRD物相分析、金相组织观察及TEM精细组织分析研究了奥氏体组织结构状态对Fe-0.88C-1.35Si-1.03Cr-0.43Mn钢中温等温相变鼻温和孕育期的影响,以及不同温度奥氏体化后240℃等温20 min试样的组织结构特征。试验发现,随着奥氏体化温度的升高,中温等温开始转变的鼻温移向更低温度并且相变孕育期缩短;不同温度奥氏体化后同为240℃等温20 min处理,虽然均形成由贝氏体铁素体亚条平行排列构成的束状贝氏体组织,但贝氏体组织的精细结构状态不同,突出的差别在于对应低温奥氏体化贝氏体亚条端部边界具有凸起结构,而对应高温奥氏体化贝氏体亚条端部边界较为平齐且呈现楔形结构。不能简单地以马氏体切变机制认识试验钢中贝氏体组织的形成。 The influence of austenitization temperature on the incubation period and the bainitic phase transformation behaviour in high-carbon silicon steel has been investigated using X-ray diffraction(XRD), optical microscopy and transmission electron microscopy(TEM). The microstructure characteristics of the isothermal transformation(240 ℃, 20 min)products were also studied. It was found that the nose temperature of bainite transformation and incubation period decreased with the increasing austenitizin...
无抑制剂取向硅钢概述
概述了无抑制剂法生产取向电工钢的特性及其用途;总结无抑制剂生产取向电工钢的原理及工艺方案.重点讨论了成分方案,即元素对磁性能的影响和最终高温退火方案对二次再结晶的影响.研究结果表明,无抑制剂取向硅钢化学成分范围没有普通取向硅钢和高磁感取向硅钢严格,提高了成材率;最终高温退火决定了二次再结晶的好坏,从而最终决定成品磁性能,最佳的高温退火温度在850～950℃之间. This article provides an overview on the characteristics and uses of inhibitorless process producing grain-oriented electrical steels.The mechanism of inhibitorless process and technology programs were discussed.The results show that the chemical composition and final annealing were determined according to magnetic properties.The inhibitor-free grain oriented silicon steel has loose range of chemical composition;Secondary recrystallization occurs mainly in the final annealing and the best anneal...
宝钢无取向电工钢发展历程及生产技术进步
简要介绍了宝钢无取向电工钢的发展历程、产品大纲、电磁性能控制情况,以及高附加值新产品的开发、应用情况。概述了近年来宝钢无取向电工钢生产技术进步,主要包括夹杂物控制技术、连轧机高牌号硅钢制造技术、同板差控制技术、环保涂层开发技术等。 This paper briefly summarizes the development history, product catalogue, and magnetic properties of non-oriented electrical steel sheets at Baosteel, as well as the development and application of high-value-added steel grades. Recent advances in manufacturing electrical steel sheets are also introduced, including technologies for controlling inclusion, producing high-grade steel strips by a tandem rolling mill, and controlling the transverse thickness difference of steel sheets, as well as the ...
