硅钢资料

通过对取向硅钢进行脉冲磁场退火实验,发现在相同的退火时间(6.0 min)内,低于1 T的脉冲磁场可以在一定程度上提高取向硅钢的磁感(B8),而高于1 T的脉冲磁场则会使取向硅钢的磁性能急剧恶化.同时发现,脉冲直流电加热方式会使取向硅钢的磁性能恶化.研究表明,脉冲磁场退火有望成为一种调控材料微观结构的有效手段. We have carried out experiments of annealing by pulse magnetic field.The results show that a pulse magnetic field with intensity lower than 1 T can promote magnetic induction density(B8) of grain-oriented silicon steel,while the magnetic properties deteriorate sharply when intensity is higher than 1 T.It has also been found that heating by using pulse direct current can cause the magnetic properties to deteriorate,in contrast to the traditional heating using resistance furnace.Our research shows... 

【作者】 周威； 刘侃； ...

硅钢是钢铁产品中的\"工艺品\",是高附加值产品,通过对我国主要硅钢生产厂家的工艺设备,市场情况分析,简要介绍了我国硅钢生产消费现状,未来生产能力预测及硅钢未来发展趋势。 Silicon steel is the \"crafts\" of steel products,also is high value-added product.By analyzing process equipment and market condition of major silicon steel-making plant of China,it briefly introduces our current production consumption status,future production capacity prediction and future development trend of silicon steel. 

实验室模拟薄板坯连铸连轧(TSCR)流程制造高磁感取向硅钢,借助电子背散射衍射(EBSD)技术对不同Sn含量的热轧板织构进行了研究。研究结果表明:不同Sn含量热轧板表层及次表层均为高斯织构、铜型织构及黄铜织构的混合织构,中心层为{100}面织构;Sn含量为0.1%时,热轧板表层及次表层高斯织构组分最多,取向密度最大,成品磁感最高,达到1.875 T。 Texture of grain oriented silicon steel hot rolled by thin slab casting and rolling process(TSCR) in laboratory with different Sn contents was analyzed by electron back-scattered diffraction(EBSD).The results show that the hot rolled slabs with different Sn contents have the same texture,i.e.,Goss,Copper and Brass.Specifically,the texture of core layer is {100};While the hot rolled slab with 0.10% Sn,the surface layer and subsurface layer have a sharpness Goss texture and the finished products h... 

【作者】 张煜； 朱国辉； ...

为开发高效电机用冷轧无取向电工钢,借助实验室薄板坯连铸连轧模拟设备及扫描电镜、透射电镜等检验手段研究了成分、组织、织构和析出物等对无取向电工钢磁性能的影响规律;结果表明:常化处理使组织均匀化并增加有利于磁性提高的织构组分;采用CSP流程开发的高效电机用无取向电工钢铁损平均值3.4 0 W/kg,磁感≥1.68 T。 In order to develop electrical steel for high efficiency motor,effect of components,microstructure,texture and precipitation on magnetic property of electrical steel are analyzed.From the result,normalizing treatment makes microstructure uniform and increases component of favorable texture.Iron loss of electrical steel developed by CSP line is 3.40W/kg and magnetic induction is more than 1.68T. 

研究了应用电感耦合等离子体质谱(ICP-MS)同时测定硅钢中痕量铝、钼、钒、钛、铌元素的分析方法。通过条件试验对测量参数进行了优化,确定RF功率1 400 W,泵速30rpm,采样深度140,雾化压力0.90。样品采用硝酸分解,以Be、Y混合内标校正了测量过程中高基体引起的信号漂移。根据测量时存在的质谱干扰情况,选择同位素27 Al、98 Mo、51 V、47 Ti和93 Nb作为测定同位素,同时通过调节仪器参数使得双电荷离子和氧化物离子的产率最低,以减少其带来的干扰。采用基体匹配法配制校准溶液,以标准加入法建立工作曲线,并扣除试剂空白。该方法各元素的测定下限均可达到1μg/g。用于硅钢标准样品的测定,所得结果与参考值完全吻合,各元素的RSD小于5.2%。 A method for the determination of trace aluminum,molybdenum,vanadium,titanium and niobium in silicon steel by inductively coupled plasma mass spectrometry(ICP-MS) was described.A series of single parameter condition experiment was conducted.The optimized operation parameters with RF power 1 400 W,turbo pump rate 30 rpm,sampling depth 140 and nebulizer pressure 0.90 were obtained.The samples were dissolved by HNO3,and the Be and Y mixing internal standard were used to eliminate the signal drift c... 

为了消除硅钢在连续退火机组产生的浪形缺陷,对浪形缺陷产生的主要原因进行了分析。制定了相应控制措施,对炉内带钢张力、冷却段输出、碳套辊与带钢的同步性、无氧化炉燃烧状态等参数进行了调整;在生产组织上安排高低牌号宽窄规格穿插生产、定期更换碳套辊等,实施后效果明显。 The main cause leading to waviness defects of silicon steel is analyzed in order to eliminate the waviness defects of silicon steel in continuous annealing line.And thus corresponding measures for controlling these defects are made by means of adjusting these parameters such as the tension of silicon steel coils in continuous annealing furnace,the output in cooling section and the combusting condition of the non-oxidation furnace as well as keeping the synchronization between carbon sleeved roll... 

为研究退火工艺对普通取向硅钢初次再结晶组织的影响,对经不同温度、保温时间和升温速率退火后的材料组织进行了分析。结果表明:在等温退火条件下,加热至600℃时开始发生初次再结晶,800℃以上初次再结晶组织发展完善;而在最终冷轧板直接进行最终高温退火的情况下,加热温度在500～700℃时,将升温速率提高到80℃/h,初次再结晶组织更易于发展完善。 To investigate the influence of annealing process on the recrystallization of common grain oriented silicon steel,microstructures of sheets annealed at different temperature,soaking time and heating rate are observed.Results show that under the condition of isothermal annealing,recrystallization begins at 600℃ and fully develops above 800℃,while in the case that the final cold rolled sheets are directly thrown to final high temperature annealing,recrystallization is likely to develop with the he... 

对w(Si)=3%无取向硅钢进行表面机械研磨处理(SMAT)和异步轧制(CSR),获得表面纳米结构,再进行550～650℃、4 h固体粉末渗硅处理,用透射电镜(TEM)、扫描电镜(SEM)和X射线衍射仪(XRD)研究表层组织演变。结果表明:经过SMAT后,w(Si)=3%无取向硅钢表面形成了等轴状、取向呈随机分布的、晶粒尺寸为10 nm的纳米晶组织;异步轧制后,表面纳米晶组织保持不变;550～650℃、4 h渗硅处理后,SMAT+CSR样品表面形成化合物层,其厚度随着温度的升高由17μm增加到52μm;化合物层由Fe3Si和FeSi相组成. Nanostructured surface layer was fabricated on a 3%(mass fraction) non-grain oriented silicon steel by means of surface mechanical attrition treatment(SMAT) and cross-shear rolling(CSR),and then a solid powder siliconizing treatment was carried out for the SMAT+CSR sample at 550~650 ℃ for 4 h.The microstructural evolution was examined by using transmission electron microscopy(TEM),scanning electron microscopy(SEM) and X-ray diffraction(XRD).Experimental results show that: equiaxed nanocrystallin... 

研究了CSP工艺流程生产的硅含量为1.5%的无取向电工钢在不同常化温度下对磁性能的变化。研究结果表明:随着常化温度的提高,热轧板的晶粒尺寸增大,且组织均匀性提高;此外成品的有利织构组分{100}<0vw>、α、η增强,不利织构组分减弱;铁损P1.5/50呈下降趋势,磁感B50上升平缓。在常化工艺为970℃×2.5min下,对应的铁损P1.5/50<3.4W/kg,磁感B50>1.74T。 The effect of normalizing temperature on the magnetic properties of non-oriented electrical steel containing 1.5%silicon produced by CSP process was studied.The results show that with increasing normalizing temperature,the average grain size of hot-rolled plate increases and the microstructure uniformity is improved.Furthermore,the texture components of finished products are improved through enhancing of{100}<0vw>,αandηtextures and weakening of{111}<112>texture;the core loss P1.5/50 ... 

分析了冲裁硅钢芯片时出现的质量问题,针对影响硅钢芯片冲裁质量的4大因素——人、原材料状态、工艺和工装进行了工艺试验和分析,根据原材料状态的差异,采用不同工艺方案,特别是如何合理选择冲裁模具间隙,解决了硅钢芯片冲裁时产生的主要质量问题,使冲裁的硅钢芯片达到最佳质量状态,并满足硅钢芯片的使用性能。 The problems occurred during silicon steel chip punching and the factors that affect the quality of silicon steel chip punching were analyzed,the factors include 4aspects,that is,people,raw material status,process and frock,at the same time,process tests and analysis aimed at the factors that affect punching quality were did,according to the difference of raw material status,corresponding process schedules wee taken,especially in how to reasonably select punching dies clearance,which solved the ...