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【摘要】 <正>2012年3月29日中国钢铁工业协会在上...
2012-04-28 184 5.8

通过微观组织表征、高温拉伸和断口形貌分析,研究了钇(Y)元素对6.5%Si无取向硅钢组织、高温拉伸及断裂机制的影响。研究结果表明,添加Y元素可以在钢液中形成YS和YP的复合析出。YS和YP可以充当异质形核基底,提高形核率,细化凝固组织。热轧组织不均匀,由表层至芯部分别形成等轴晶、等轴晶/拉长晶和拉长晶的混合组织。退火后,热轧变形组织转变为等轴晶,含Y实验钢的退火组织得到明显细化。500℃时效处理后,含Y实验钢具备较低的有序度,300℃的拉伸断口呈现韧性断裂特征,断后伸长率达到20.2%。相反,无Y实验钢发生脆性断裂,断后伸长率仅为2.1%。研究结果证实,Y元素可以通过组织细化和降低有序度提高6.5%Si无取向硅钢的中温塑性。 The effects of yttrium(Y)on microstructure,elevated-temperature tensile properties and fracture mechanism of 6.5% Si non-oriented electrical steel were investigated by means of microstructure characterization,high-temperature tensile test and fracture analysis.The results showed that the doping of Y introduced composite Y-rich precipitates(YS/YP)in the melt.YS and YP precipitates were qualified for heterogeneous nucleation agents,which thus raised the nucleation rate and refined the solidificati... 
2022-01-28 214 5.8

介绍了重庆钢铁股份有限公司炼钢厂生产低碳低硅钢的脱氧工艺,对连铸过程中水口结瘤的原因进行分析,并提出了优化措施。生产实践表明:钢水中的活性氧质量分数控制在10×10-6~30×10-6时,单中包浇铸炉数由6~7炉提高到11~12炉,同时能保证连铸顺行和减少铸坯气孔。 The deoxidation process of low-carbon and low-silicon steel in steel plant of Chongqing Steel was introduced.The nuzzle clogging was analyzed and some measures were put forward.Production experiments showed that when the active oxygen was controlled between 10×10-6~30×10-6,the amount of furnaces would rise from 6~7 to 11~12,which will make the casting process work well and reduce casting holes. 
2011-05-28 157 5.8

采用XRD、SEM和激光粒度仪等手段,观察并研究了不同特性氧化镁在硅钢表面形成硅酸镁底层形貌特点,并结合热力学和差热-失重分析了MgO-SiO2的反应机理。研究结果表明:粒度小,活性值高的特种氧化镁在高温退火过程中与基体表面氧化物生成的硅酸镁底层,界面中硅酸镁底层嵌入基体较多,表面致密,颗粒细小,有利于形成附着性能优良的硅酸镁底层。 Surface microstructure of Mg2SiO4 coatings formed on the surface of oriented silicon steel coated with different kinds of MgO was investigated by XRD and SEM.The reaction mechanism between MgO and SiO2 was analyzed by TG-DSC and thermodynamic calculation.Results revealed that when the MgO with finer microstructure size and higher activity is employed,a dense Mg2SiO4 layer with finer microstructure and good binding to the steel substrate can be obtained.The results are very helpful for the prepar... 
2011-10-28 180 5.8

采用铸坯低倍组织检验和化学分析的方法,研究板坯连铸机二冷区电磁搅拌器电流和频率参数对无取向电工钢XG800WR板坯中心偏析和等轴晶率的影响,结果表明:铸坯等轴晶率随着搅拌器电流强度和电流频率的增大而增加。采用二冷区电磁搅拌可减小中心易偏析元素S的偏析,试验得出:减小铸坯S偏析效果最好的电磁搅拌参数为电流380~400A,频率6Hz。 The effect of electromagnetic stirring current and frequency parameter at secondary cooling area on the central segregation and equiaxed crystal ratio of XG800WR non - oriented electrical steels slab was investigated through the methods of chemical and macrostructure analysis.The results shows that the rate of equiaxed crystal zone is going up with increasing of current intensity and current frequency.Electromagnetic stirring in the secondary cooling area can be easily reduced segregation caused... 
2011-01-28 211 5.8

针对本钢薄板坯铸机在生产无取向电工硅钢的过程中存在的铸坯拉断、中包增碳、增氮等问题,进行了连铸工艺优化。通过采用新型无碳中间包覆盖剂、环保中间包干式料及专用结晶器保护渣后,降低了铸坯增碳量;通过控制钢包到中间包的增氮环节,降低钢水增氮;适当增大二冷水量,控制钢水过热度,防止铸坯拉断等生产事故的发生。改进工艺后,精炼后到成品铸坯的平均增碳量能控制在10×10-6以内,平均增氮量能控制在4×10-6以内。 The technology optimization has been adopted for preventing nitrogen increasing and carbon increasing in Benxi thin slab producing non-oriented silicon steel.Measures accordingly were adopted and satisfactory results were achieved. 
2011-05-28 209 5.8

通过制备磷酸二氢铝硅钢涂层,研究了氧化锌对无铬涂层耐盐雾性能、电化学性能和附着性的影响。结果表明,硅钢表面涂层含有4.0%的氧化锌时,涂层具有最高的耐腐蚀性能和电化学性能,而且其致密表面最为平整,没有裂纹出现。 The effects of ZnO on the salt spray resistance property, electrochemical performance and adhesiveness of silicon steel insulating coating were studied. The results show that the best corrosion resistance and electrochemical properties can be obtained when the coating contains 4.0% oxide zinc, and the dense surface is smooth without cracks. 
2014-07-28 213 5.8

采用扫描电镜、场发射扫描电镜、能谱仪等对50SW1300冷轧无取向硅钢中的夹杂物分不同尺寸区间进行数量统计,利用主成分回归分析法,即数据的标准化处理—主成分分析—回归分析—标准化的变量还原成原始变量—确定显著影响因素,综合分析夹杂物总量及各尺寸区间的夹杂物数量对无取向硅钢磁性能的影响。结果表明:主成分回归分析能够从夹杂物尺寸区间及数量的多个影响因素中提取主要的因素,定量研究其对磁性能的影响。分析表明,显著影响无取向硅钢铁损的夹杂物为100~500nm的AlN、AlN+MnS、MnS、Al2O3、AlN+Al2O3,而劣化磁感最明显的夹杂物尺寸区间为100~200nm。 Different size intervals of inclusions in cold rolled non-oriented silicon steel 50SW1300 were counted by scanning electron microscope(SEM),field emission scanning electron microscope(FESEM)and energy disperse spectroscopy(EDS).With principal component regression method:standardization for experimental data,principal component analysis,regression analysis,transform standardized variables into original variables,determination of significant factor,effects of the total number of inclusions and the... 
2014-10-28 236 5.8

【作者】 刘玲月; 李军辉; ...
2011-02-28 177 5.8

借助电子背散射(EBSD)技术对AlN为主抑制剂的Hi-B取向硅钢常化工艺的中间冷却制度进行了研究。结果表明:常化后试样均发生了完全再结晶,在60℃/s冷速下组织最均匀;在合适的冷却制度下常化板表层保留了强的Goss织构,它深入到1/4厚度处,并且形成对Goss织构有利的强{554}<225>织构。 The intermediate cooling system of Hi-B oriented silicon steel with AlN main inhibitor in normalizing process was studied by means of electron back diffraction(EBSD) technique. The results show that:the specimens after normalizing are fully recrystallization, and the microstructure is most uniform under the intermediate cooling rate of 60℃/s; under suitable cooling system, normalized plate surface retains strong Goss texture, it penetrates into the 1/4 thickness of the plate and forming strong {... 
2014-11-28 177 5.8

观察了取向硅钢极薄带经冷轧至不同厚度,并经过不同工艺热处理后的显微组织及亚结构。结果表明:冷轧压下量越大,显微组织中位错密度越高,冷变形组织越多,等轴晶粒越少;增加冷轧压下量可以使试样的再结晶温度降低,当钢带厚度为0.08 mm时,在650℃退火时就能发生明显的再结晶。 Microstructure and substructure of the grain oriented ultra-thin silicon steel sheets is analyzed,which are rolled down to different thickness and treated with different heat treatment process.The result shows that there are higher dislocation density,more cold deformation structure and less equiaxed crystal grain in microstructure of the steel sheets with more cold rolled reduction.Increase of cold rolled reduction will decrease recrystallization temperature,and when thickness of the steel shee... 
2012-11-28 200 5.8

分析了冲裁硅钢芯片时出现的质量问题,针对影响硅钢芯片冲裁质量的4大因素——人、原材料状态、工艺和工装进行了工艺试验和分析,根据原材料状态的差异,采用不同工艺方案,特别是如何合理选择冲裁模具间隙,解决了硅钢芯片冲裁时产生的主要质量问题,使冲裁的硅钢芯片达到最佳质量状态,并满足硅钢芯片的使用性能。 The problems occurred during silicon steel chip punching and the factors that affect the quality of silicon steel chip punching were analyzed,the factors include 4aspects,that is,people,raw material status,process and frock,at the same time,process tests and analysis aimed at the factors that affect punching quality were did,according to the difference of raw material status,corresponding process schedules wee taken,especially in how to reasonably select punching dies clearance,which solved the ... 
2013-10-28 132 5.8

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