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本实用新型公开了E字型硅钢片的级进模冲压装置,属于冲压模具设备领域,所述下模具包括与冲孔凸模、冲方孔凸模、切断凸模分别对应且相适配的冲孔凹模、冲方孔凹模、切断凹模,所述上模具上设有对条料板进行输送的导料板,所述冲孔凸模、冲孔凹模均设有两对并且并排设置,且每对冲孔凸模、冲孔凹模均设有两个,每个所述冲孔凸模、冲方孔凸模、切断凸模的顶端均用微米级间隙固定安装于上模具上,所述冲孔凹模、冲方孔凹模、切断凹模的底端均用微米级间隙固定安装在下模具上。本实用新型中各个凸、凹模分别采用硬质合金拼块、镶块式的结构并用微米级间隙固定安装在上、下模具上,这样不仅可节省材料的费用,同时还便于人们后期对模具的维修和使用。
2021-03-10 113 6.8

本发明提供了一种强磁性取向高硅钢极薄带及其制备方法,属于电工钢制造领域,所述强磁性取向高硅钢极薄带包括以下质量百分比的元素:C:0.0045%~0.0060%、Si:4.5%~5.0%、Mn:0.23%~0.32%、S:0.02%~0.03%、Bi:0.03%~0.08%、Als:0.027%~0.035%、Cu:0.02%~0.03%,N:0.008%~0.010%,P<0.005%,其余为铁,其中所述Cu、S、N元素在熔炼时以含硫氮和铜的多核配位化合物的方式加入所述高硅钢;本发明通过对取向高硅钢的原料组分进行设计,采用含硫氮和铜的多核配位化合物和Bi元素作为合金抑制剂,所制得的强磁性取向高硅钢极薄带晶粒细小,组织均匀,具有高磁感应强度,低铁损的优良磁性能。
2021-02-01 89 6.8

本发明公开了一种控制无取向硅钢厚度稳定性的轧制工艺,涉及硅钢厚度控制方法领域。本发明通过降低硅钢精轧入口温度,并调节粗轧区域、精轧区域和卷取区域的生产参数,保证后续卷取工序的轧制稳定性及卷形质量,严格控制无取向硅钢的厚度稳定性。本发明提供的轧制工艺使硅钢的厚度命中率得到了明显提升,提升了后续冷轧工艺的轧制速度,轧制力波动减小,提高了产品质量。
2021-01-07 113 6.8

本实用新型涉及硅钢生产设备技术领域,具体公开了硅钢用氧化镁冷涂托盘结构,包括机架和托盘本体,托盘本体固定在机架上,托盘本体位于涂层机上,所述涂层机包括一对上下设置且转动连接在机架上的胶辊,所述托盘内设有气管,所述气管一端固定在机架上,另一端水平设置在托盘本体靠近底部的位置,机架上设有连通气管的供气件。本专利中,通过对气管提供气流,从气管鼓出的气体对托盘本体内的涂层液形成搅拌的作用,避免涂层液中的氧化镁颗粒沉底结晶,本方案结构简单,无需对托盘本体进行其它加工改造,适合在结构紧凑的涂层机中使用。
2020-12-29 87 6.8

根据本发明的一个实施例的粘接涂料组合物,其包含聚乙烯丙烯酸酯,所述聚乙烯丙烯酸酯包含由以下化学式1表示的重复单元和由以下化学式2表示的重复单元,所述聚乙烯丙烯酸酯包含65至90重量%的由以下化学式1表示的重复单元、10至35重量%的由以下化学式2表示的重复单元。
2020-12-17 95 6.8

利用OM、TEM与EDS技术,对Fe-3.2%Si低温取向硅钢热轧板进行不同常化冷却工艺处理后的显微组织、析出相及最终产品的磁性能进行分析,并与热轧板的组织和析出相进行对比。结果表明,常化板较热轧板的表层组织均匀,基体中再结晶比例增加,带状组织变窄;常化板中析出物的数量明显比热轧板的多,析出物主要有AlN、MnS及复合析出的(Cu,Mn)S等。在常化温度1120℃、保温3 min的条件下,采用二段式冷却较空冷、淬沸水、淬常温水的冷却工艺,常化板表层显微组织更均匀,沿板厚方向的显微组织的不均匀性显著,取向硅钢的磁性能最高;常化后采用二段式冷却工艺析出的细小析出物数量最多,且弥散分布在基体中,抑制剂的抑制效果最好,对成品获得高磁性最有利。 Microstructure, precipitate and magnetic characteristic of final products with different normalizing cooling processes for Fe-3.2%Si low-temperature hot-rolled grain-oriented silicon steel were analyzed and compared with the hot-rolled plate by optical microscopy(OM), transmission electron microscopy(TEM), and energy dispersive spectrometry(EDS). The results show that, the surface microstructure is uniform, the proportion of recrystallization in matrix increases, and the banding textures are nar... 
2014-03-28 100 5.8

本文介绍了无取向硅钢C6涂液的性能,研究了配水量、固化程度和涂层厚度等因素对无取向硅钢C6涂层性能的影响。结果表明,随着配水量的增加,完全固化所需的时间增加,涂液固体含量降低,涂层厚度减小;随着固化程度的提高,涂层硬度先增大然后趋于恒定,而柔韧性逐渐变差,在过固化后急剧恶化;涂层厚度对涂层的表面外观、附着性和绝缘层间电阻均有显著影响。 Based on the introduction about the performance of C6 varnish for non-oriented silicon steel sheets,effects of water amount,curing degree and coating thickness are discussed. Results show that with the increase of water amount,the time required to cure completely extends,and both the solid content of C6 varnish and the coating thickness decrease. As the curing degree increases,the hardness of the coating increases first and then tends to be constant,however the flexibility degenerates,especially... 
2014-02-28 117 5.8

结合硅钢退火炉项目中应用PDSOFT软件进行三维配管设计的案例,描述PDSOFT软件的应用过程,总结其使用要点,分析其优缺点,并提出了推广三维设计软件的思路,对今后PDSOFT在相似项目中的推广应用有参考和借鉴价值。 Combining the case of using PDSOFT software to design the three-dimensional piping,the application process of the PDSOFT software is described,the using points are summarized,the advantages and disadvantages are analyzed,and the ideas of promoting the three-dimensional design software are put forward,which have a strong reference value for the promotion and application of PDSOFT in similar projects in the future. 
2014-04-28 58 5.8

试验了通过NaCl-KCl-NaF-SiO2熔盐在电流密度50 mA/cm2、电沉积脉冲电流正反向比9:1和750850℃60min电沉积下阴极(/mm)20×20×0.5的1.6Si无取向冷轧硅钢片断面层硅的分布,并通过计算得出Si的扩散系数。结果表明,电沉积温度由750℃提高至850℃时,试样中Si含量增加,扩散的深度由18μm提高到40μm;电沉积温度与Si在钢中的扩散系数近似符合Arrhenius指数关系。 The distribution of silicon at cross section of cathode(/mm) 20 × 20 × 0.5 sheet of 1.6Si non-oriented cold rolled silicon steel after electro-deposit treatment by NaCl-KCl-NaF-SiO2 molten salt with current intensity 50 mA/cm2,electro-deposit pulse current positive-negative ratio 9:1 at 750 850 ℃ for 60 min has been tested and the diffusion coefficient of Si is obtained by calculation.Results show that with increasing electro-deposit temperature from 750 ℃ to 85... 
2014-06-28 112 5.8

分析了冲裁硅钢芯片时出现的质量问题,针对影响硅钢芯片冲裁质量的4大因素——人、原材料状态、工艺和工装进行了工艺试验和分析,根据原材料状态的差异,采用不同工艺方案,特别是如何合理选择冲裁模具间隙,解决了硅钢芯片冲裁时产生的主要质量问题,使冲裁的硅钢芯片达到最佳质量状态,并满足硅钢芯片的使用性能。 The problems occurred during silicon steel chip punching and the factors that affect the quality of silicon steel chip punching were analyzed,the factors include 4aspects,that is,people,raw material status,process and frock,at the same time,process tests and analysis aimed at the factors that affect punching quality were did,according to the difference of raw material status,corresponding process schedules wee taken,especially in how to reasonably select punching dies clearance,which solved the ... 
2013-10-28 55 5.8

为了解决在纹理背景下冷轧硅钢表面缺陷的分割问题,提出了基于局部信息结构张量和活动轮廓模型的硅钢表面缺陷分割方法。将图像的局部信息引入到结构张量中;在结构张量提取的特征空间中,以KL距离作为区域的概率密度相似性度量建立分割图像的活动轮廓模型;采用Split-Bregman数值解法对模型进行求解。运用提出的分割方法对硅钢表面的一些常见缺陷如纵向划伤、横向划伤、异物和孔洞等进行分割实验。实验结果表明,该方法可以准确地分割出硅钢表面缺陷区域,验证了该方法的有效性。 In order to address the segmentation problem for cold rolled silicon steel surface defect based on the texture background,a novel method based on structure tensor and active contour model is proposed.Image local information is introduced to the structure tensor.In the extracted feature space of structure tensor,KL distance is treated as a regional similarity measure of the probability density to establish active contour model for image segmentation.The numerical solution of Split-Bregman is used... 
2023-05-09 142 5.8

研究了传统工艺流程生产的2%Si无取向电工钢在不同退火温度下的磁性能。研究结果表明,随着退火温度的升高,显微组织均匀性提高且晶粒尺寸增大;有利织构组分{100}<0vw>、α、η增强,不利织构组分减弱;成品的铁损P1.5/50先下降后略有上升,磁感B50上升平缓;在890℃×2 min的退火工艺条件下,成品电工钢的磁性能最佳,对应的铁损P1.5/50小于3.2 W/kg,磁感B50高于1.74 T。 In this paper,the effect of annealing temperature on magnetic properties of non-oriented electrical steel with 2% silicon was studied.Results show that the uniformity of microstructure and the average grain size increase with the rise of annealing temperature.The texture components of annealing can be improved by enhancing {100} <0vw>,α,η fiber textures and weakening {111} <112> fiber texture.The tendency of core loss P1.5/50 shows that it decreases first and then increases,while the... 
2013-01-28 91 5.8

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