硅钢资料

分析了冲裁硅钢芯片时出现的质量问题,针对影响硅钢芯片冲裁质量的4大因素——人、原材料状态、工艺和工装进行了工艺试验和分析,根据原材料状态的差异,采用不同工艺方案,特别是如何合理选择冲裁模具间隙,解决了硅钢芯片冲裁时产生的主要质量问题,使冲裁的硅钢芯片达到最佳质量状态,并满足硅钢芯片的使用性能。 The problems occurred during silicon steel chip punching and the factors that affect the quality of silicon steel chip punching were analyzed,the factors include 4aspects,that is,people,raw material status,process and frock,at the same time,process tests and analysis aimed at the factors that affect punching quality were did,according to the difference of raw material status,corresponding process schedules wee taken,especially in how to reasonably select punching dies clearance,which solved the ... 

为了确定普通冷轧取向硅钢最优的中间完全脱碳退火工艺,在其一次冷轧后进行5种不同工艺的脱碳退火处理,借助扫描电镜及电子背散射衍射技术研究了不同工艺脱碳退火后的组织、织构和脱碳效果。结果表明:经5种工艺脱碳退火处理后,初次再结晶的平均晶粒尺寸均约为19μm,且不随退火温度和时间的变化而变化;经840℃×10min工艺退火后的晶粒最均匀,高斯织构位向更准确,高斯织构面积分数最多,为3.1%,可将碳脱至0.003 5%。 In order to determine the optimal intermediate complete decarburizing annealing processes for common grain-oriented(CGO)silicon steel,five kinds of intermediate decarburizing annealing processes were conducted,the microstructure,texture and decarbonization after different decarburizing annealing processes were studied by scanning electron microscopy and electro back-scattered diffraction(EBSD)technology.The results show that the average grains sizes of primary recrystallization were about 19μm a... 

针对某厂DMS森吉米尔轧机生产无取向硅钢表面麻面缺陷的问题，根据生产实际，对其形成原因从乳化液及工作辊两方面因素进行了分析。结果表明：乳化液对麻面缺陷的产生有一定影响，但不是主要因素，主要原因是由于二十辊森吉米尔轧机工作辊辊径较小，轧制相同长度带钢轧辊运转周期较大，容易产生疲劳失效而导致。为此，提出通过调整冷轧工序成品轧制道次的压下率以减小轧制力，从而减小工作辊的磨损疲劳；通过对轧制乳化液浓度、温度的合理控制，以改善润滑效果、提高轧制速度，而进一步缓解轧辊疲劳的改进措施，使该钢厂无取向硅钢麻面缺陷发生率由原来的18%降至0.8%,带钢表面质量明显改善。 For the problem of surface pockmarks of non-oriented silicon steel strip produced by a DMS Sendzimir mill, based on the production practice, the formation causes were analyzed from two aspects of emulsion and working roll. The results show that the emulsion has a certain effect on the formation of surface pockmarks defects, but it is not the main factor. The main reason is that the working roll diameter of the 20-high Sendzimir mill is small, and the running period of the roll rolling the same l... 

运用电子背散射衍射(EBSD)技术,研究了50W600无取向硅钢在热轧→冷轧→退火工序间织构的演变。结果表明:由于热轧板沿板厚方向的应力场和温度场存在差异,导致热轧板不同层织构类型和强度存在差异;热轧板表层主要存在铜型、黄铜和高斯织构,1/4层织构主要为α纤维织构和较弱的高斯织构,中心层织构较单一,主要为α纤维织构;和热轧板相比,冷轧板各层织构差异较小,为典型的轧制织构(α纤维织构和γ纤维织构);退火板各层都表现为γ纤维织构增强、α纤维织构减弱,旋转立方织构基本消失。 The texture evolution of 50W600non-oriented silicon steel in hot rolling,cold rolling and annealing process was investigated by electron back-scatter diffraction(EBSD)technology.Results show that the hot rolled plate texture types and intensities along thickness direction were different because of the different stress fields and temperature fields.The major texture types in the surface of hot rolled plate were copper,brass and Gauss texture.The texture was composed ofαfibre texture and weaker Ga...