钢厂
退火工艺对3.15%Si冷轧无取向硅钢组织和织构的影响
试验研究了退火温度(850~950℃)和时间(5~18 min)对2.3 mm热轧硅钢板(/%:0.036C,3.15Si,0.21Mn,0.005P,0.007S,0.032A1)6道次轧制的0.35 mm冷轧板组织和织构的影响。结果表明,退火温度越高,晶粒平均尺寸越大,900℃5 min退火时平均晶粒尺寸41.39μm,试样织构主要集中在γ取向线上的{111}<112>织构组分和{111}<110>织构组分;900℃18 min退火时平均晶粒尺寸为48.08μm,试样的{111}面织构和{112}面织构密度都明显减弱,{001}面织构增强,磁性能较优。 The effect of annealing temperature(850 ~950 ℃) and holding time(5 ~ 18 min) on structure and texture of 0.35 mm sheet by 6 passes cold-rolling from 2.3 mm hot-rolled plate of silicon steel(/%:0.036 C,3.15 Si,0.21 Mn,0.005 P,0.007 S,0.032A1) has been tested and studied.Results show that the higher the annealing temperature the coarser the average grain size;As annealing at 900 ℃ for 5 min the average grain size of steel sheet is 41.39 μm,and the texture in sample is mainly concentrated in y orie...
铜含量对TSCR工艺生产取向硅钢热轧织构的影响
取向硅钢热轧板中织构梯度对发展完善的二次再结晶十分关键,通过添加铜可以显著降低取向硅钢板坯加热温度,从而影响热轧板织构分布。利用X射线衍射仪,分析了实验室模拟薄板坯连铸连轧(TSCR)工艺的3种不同铜含量的取向硅钢热轧板织构。结果表明:不同铜含量热轧板表面到厚度1/4处均为弱的热轧织构,热轧板心部主要为{100}面织构;铜含量约在0.4%时,热轧板次表层的{110}<001>织构比例最高,而热轧板心部的{100}<110>织构比例最低;铜含量对热轧织构中{114}<110>和{001}<100>织构发展有显著影响。 The texture gradient in hot rolled grain oriented silicon steel strip is one of the essential factors to achieve a perfect secondary recrystallization.The addition of copper can significantly reduce the slab reheating temperature of grain oriented silicon steel,so as to impact the texture distribution in the hot rolled strip.The texture of hot rolled grain oriented silicon steel strip as-rolled by thin slab casting and rolling process(TSCR) in laboratory with three different copper contents was ...
冷轧无取向硅钢表面麻面缺陷成因分析及其控制措施
针对某厂DMS森吉米尔轧机生产无取向硅钢表面麻面缺陷的问题，根据生产实际，对其形成原因从乳化液及工作辊两方面因素进行了分析。结果表明：乳化液对麻面缺陷的产生有一定影响，但不是主要因素，主要原因是由于二十辊森吉米尔轧机工作辊辊径较小，轧制相同长度带钢轧辊运转周期较大，容易产生疲劳失效而导致。为此，提出通过调整冷轧工序成品轧制道次的压下率以减小轧制力，从而减小工作辊的磨损疲劳；通过对轧制乳化液浓度、温度的合理控制，以改善润滑效果、提高轧制速度，而进一步缓解轧辊疲劳的改进措施，使该钢厂无取向硅钢麻面缺陷发生率由原来的18%降至0.8%,带钢表面质量明显改善。 For the problem of surface pockmarks of non-oriented silicon steel strip produced by a DMS Sendzimir mill, based on the production practice, the formation causes were analyzed from two aspects of emulsion and working roll. The results show that the emulsion has a certain effect on the formation of surface pockmarks defects, but it is not the main factor. The main reason is that the working roll diameter of the 20-high Sendzimir mill is small, and the running period of the roll rolling the same l...
