钢厂
一类非线性系统控制方法在硅钢生产上的应用
硅钢工业退火炉温度控制具有强耦合、纯滞后、多扰动等特点,它的控制方法代表着一类非线性系统控制的解决方法。以硅钢工业退火炉温度为控制对象,在双交叉限幅控制的基础上引入了智能学习系统,形成了基于智能学习系统的双交叉限幅控制方法来解决此类非线性系统的控制问题,并通过模块化的编程来实现其功能。结果表明:与传统的PID控制相比,该控制方法的控制精度、抗扰性等控制指标有明显提高,是解决此类非线性控制的一种有效方法。 The temperature control of silicon steel industrial annealing furnace has the features of strong coupling,pure lag,multidisturbance. The control method represents the solution of a class of nonlinear control systems. The control object is the temperature control of silicon steel industrial an-nealing furnace, the intelligent learning system based on Double Across Limit Control is introducedand used to solve control problem of this kind of nonlinear system, and the module programming isused to re...
表面机械研磨/异步轧制无取向硅钢薄带的渗硅行为
对w(Si)=3%无取向硅钢进行表面机械研磨处理(SMAT)和异步轧制(CSR),获得表面纳米结构,再进行550~650℃、4 h固体粉末渗硅处理,用透射电镜(TEM)、扫描电镜(SEM)和X射线衍射仪(XRD)研究表层组织演变。结果表明:经过SMAT后,w(Si)=3%无取向硅钢表面形成了等轴状、取向呈随机分布的、晶粒尺寸为10 nm的纳米晶组织;异步轧制后,表面纳米晶组织保持不变;550~650℃、4 h渗硅处理后,SMAT+CSR样品表面形成化合物层,其厚度随着温度的升高由17μm增加到52μm;化合物层由Fe3Si和FeSi相组成. Nanostructured surface layer was fabricated on a 3%(mass fraction) non-grain oriented silicon steel by means of surface mechanical attrition treatment(SMAT) and cross-shear rolling(CSR),and then a solid powder siliconizing treatment was carried out for the SMAT+CSR sample at 550~650 ℃ for 4 h.The microstructural evolution was examined by using transmission electron microscopy(TEM),scanning electron microscopy(SEM) and X-ray diffraction(XRD).Experimental results show that: equiaxed nanocrystallin...
取向硅钢成品晶粒的位向测定方法
取向硅钢成品的晶粒尺寸非常大,其易磁化方向[001]晶向对于轧向的偏差角度对其磁性能影响极大。本文介绍了取向硅钢二次再结晶后成品晶粒位向的几种测定方法,包括侵蚀法、劳厄法、OIM法、极图法和非对称X射线衍射法等,并对这几种测量方法进行了比较。 The finished product of grain-oriented silicon steel has immense grain size ranging from millimeters to centimeters and the deviation angles of easy magnetization direction from rolling direction plays a remarkable role in magnetic properties of grain-oriented silicon steel.The methods in common use for determining the deviation angles of crystal direction are introduced,which include the etch-figure method,the Laue method,the OIM method,the pole figure method and the asymmetrical X-Ray diffract...
硅钢芯片冲裁工艺分析与对策
分析了冲裁硅钢芯片时出现的质量问题,针对影响硅钢芯片冲裁质量的4大因素——人、原材料状态、工艺和工装进行了工艺试验和分析,根据原材料状态的差异,采用不同工艺方案,特别是如何合理选择冲裁模具间隙,解决了硅钢芯片冲裁时产生的主要质量问题,使冲裁的硅钢芯片达到最佳质量状态,并满足硅钢芯片的使用性能。 The problems occurred during silicon steel chip punching and the factors that affect the quality of silicon steel chip punching were analyzed,the factors include 4aspects,that is,people,raw material status,process and frock,at the same time,process tests and analysis aimed at the factors that affect punching quality were did,according to the difference of raw material status,corresponding process schedules wee taken,especially in how to reasonably select punching dies clearance,which solved the ...

