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研究了含铜低碳低硅无取向电工钢中的析出相及其析出机理.由能谱(EDS)及选区电子衍射(SAED)分析可知,铁素体基体上存在的大量弥散分布的等轴状析出相为类B2结构的铜.这些铜析出相的析出机理可以是一般析出、位错析出、台阶机理相间析出和弓出机理相间析出:一般析出在550、650和750℃三个等温温度均可发生;位错析出只发生在较低的等温温度(550℃),此时析出相呈特殊的平行短列状;台阶机理相间析出也可在上述三个等温温度下发生,但650℃等温时最有利于台阶机理相间析出,此时析出相平直列状分布;弓出机理相间析出只发生在较高的等温温度(750℃),析出相弯曲列状分布. Precipitates in low-carbon low-silicon non-oriented electrical steel containing Cu were studied and the precipitation mechanism was analyzed by means of energy dispersive spectrometry(EDS) and selected area electron diffraction(SAED).It is found that the equiaxed precipitates of Cu with B2-like structure distribute dispersively in the non-oriented electrical steel.The precipitation mechanism involves general precipitation,dislocation precipitation,interphase precipitations formed by the ledge me... 
2011-03-28 113 5.8

本文介绍了无取向硅钢C6涂液的性能,研究了配水量、固化程度和涂层厚度等因素对无取向硅钢C6涂层性能的影响。结果表明,随着配水量的增加,完全固化所需的时间增加,涂液固体含量降低,涂层厚度减小;随着固化程度的提高,涂层硬度先增大然后趋于恒定,而柔韧性逐渐变差,在过固化后急剧恶化;涂层厚度对涂层的表面外观、附着性和绝缘层间电阻均有显著影响。 Based on the introduction about the performance of C6 varnish for non-oriented silicon steel sheets,effects of water amount,curing degree and coating thickness are discussed. Results show that with the increase of water amount,the time required to cure completely extends,and both the solid content of C6 varnish and the coating thickness decrease. As the curing degree increases,the hardness of the coating increases first and then tends to be constant,however the flexibility degenerates,especially... 
2014-02-28 128 5.8

为研究常化温度对热轧无取向硅钢组织与织构的影响,采用光学显微镜、背电子散射衍射技术研究了不同常化温度对其影响。结果表明,实验硅钢板在700~850℃温度下常化时,随常化温度的升高,晶粒尺寸增大,有利组分α织构增强,不利组分γ织构降低。对比研究了800℃和850℃常化热轧板CSL晶界分布图与取向差分布图,在本文研究条件下,Goss织构易在Σ=3,9的CSL晶界及晶粒取向差为30°~55°处形成。 The hot strips normalized at different temperatures were investigated by optical microscope and EBSD to study the effect of normalizing temperature on microstructure and texture of hot-rolled non-oriented silicon steel sheets.The results show that the grain size increases,the intensity of α-fibre texture increases,and the γ-fibre texture decreases when the hot strips are normalized at the 700-850 ℃.And CSL boundaries of Σ=3 and 15,and misorientation angles between 30° and 55° are more likely rel... 
2023-05-11 206 5.8

【作者】 朱传芳; 潘恒韬; ...
2023-05-12 197 5.8

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