硅钢资料

结合冶炼无取向硅钢的生产实际,对钢中硫的来源,以及炉渣性质、钢水温度、底吹强度对脱硫的影响进行了分析。研究表明,转炉钢中硫的主要来源为铁水、废钢、铁水渣及石灰带入;冶炼硅钢时,终渣碱度为3.0~3.5,w((FeO))≤20%,终点钢水温度大于等于1 680℃,加大底吹搅拌强度能提高转炉脱硫效果。硅钢平均出钢硫的质量分数为0.004 8%,能满足无取向硅钢对硫含量的要求。 With the actual production of non-oriented silicon steel,the source of sulphur and the effect of metallugic parameters like slag properties,temperature of molten steel and bottom stirring on desulphurizing ability were investigated.The results show that the main source of sulphur is molten metal,scrap,the remaining slag volume in hot metal and lime.The degree of desulphurization for smelting silicon steel can be increased through adopting the following measures,such as the basicity of finishing ... 

【作者】 刘玲月； 李军辉； ...

借助于EBSD对比研究了常化退火对高牌号无取向电工钢热轧组织和织构演变的影响,分析了常化退火对热轧板各厚度层织构的演变规律。结果表明,常化退火改善了热轧组织的均匀性,并弱化了热轧变形的γ纤维织构。升高常化退火温度,可增大热轧板的晶粒尺寸,提高{100}和{110}织构组分占有率,有利于提高无取向电工钢成品板的磁性能。 Effects of normalizing annealing on microstructure and texture of high-grade non-oriented electrical steel hot-rolled sheet were investigated by EBSD. Emphasis was put on the effects of normalizing annealing on texture evolution in the sheet thickness. The results show that the hot-rolled microstructure homogeneity is improved and the γ-fiber texture is weakened by normalizing annealing treatment. The grain size of hot-rolled sheet and intensity of the {100} and {110} favorable texture can be in... 

为进行磷酸盐系无铬无取向硅钢涂层烧结固化工艺研究,首先对磷酸盐系无铬无取向硅钢涂层进行热重-差示扫描量热(TG-DSC)分析;然后在不同烧结固化温度条件下,测定涂层板温随时间变化曲线;最终获得涂层烧结固化温度与时间(T-t)工艺曲线。通过中性盐雾试验、动电位极化、交流阻抗、涂层附着力以及扫描电子显微镜(SEM)和能谱(EDS)分析验证。结果表明,根据涂层烧结固化温度与时间(T-t)工艺曲线制备的涂层结构致密、性能优异,证明该工艺曲线具有合理性与正确性。 In order to study the curing process of chromium-free non-oriented silicon steel coatings,phosphatic chromium-free non-oriented silicon steel insulating coating was prepared and TG-DSC analysis of the coating was conducted,then the change of the actual temperature of the coated non-oriented silicon steel sheet with time at different curing temperatures was studied. Based on the experiments,the processing curves of curing temperature vs. curing time( T-t) for the chromium-free non-oriented silico...