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利用光学显微镜(OM)和扫描电镜(SEM)研究了不同稀土Ce含量的50W470无取向硅钢的铸坯、热轧板和冷轧退火板的宏观和微观组织,并采用磁性能测试仪测定其磁性能。结果表明:当稀土Ce的加入量从0增加到66×10-6(质量分数)时,铸坯的柱状晶平均宽度从3.82 mm减小到3.24 mm,等轴晶率从43.1%增加到51.3%;热轧板的平均晶粒尺寸逐渐增加,从26.2μm增加到33.3μm,再结晶百分数从24%增加到37%;退火板的平均晶粒尺寸从36.2μm增加到39.3μm;磁性能测试表明,微观组织的变化有利于50W470无取向硅钢铁损降低和磁感提高。 Macro-structure and microstructure of as-cast plate, hot rolled plate and cold rolled annealed plate of 50 W470 non-oriented silicon steel with different rare earth Ce content was studied by optical microscope(OM) and scanning electron microscopy(SEM), and their magnetic properties were measured by magnetic property tester. The results show that when the addition amount of rare earth Ce increases from 0 to 66×10-6(mass fraction), the average width of columnar crystal of the as-cast pl... 
2022-03-28 230 5.8

针对本钢薄板坯铸机在生产无取向电工硅钢的过程中存在的铸坯拉断、中包增碳、增氮等问题,进行了连铸工艺优化。通过采用新型无碳中间包覆盖剂、环保中间包干式料及专用结晶器保护渣后,降低了铸坯增碳量;通过控制钢包到中间包的增氮环节,降低钢水增氮;适当增大二冷水量,控制钢水过热度,防止铸坯拉断等生产事故的发生。改进工艺后,精炼后到成品铸坯的平均增碳量能控制在10×10-6以内,平均增氮量能控制在4×10-6以内。 The technology optimization has been adopted for preventing nitrogen increasing and carbon increasing in Benxi thin slab producing non-oriented silicon steel.Measures accordingly were adopted and satisfactory results were achieved. 
2011-05-28 200 5.8

依据GB/T 15616—2008《金属及合金的电子探针定量分析方法》,采用电子探针波谱仪对某W600硅钢中的硅含量进行了定量测定,对影响其定量测定结果的不确定度分量进行了分析,并对不确定度的各个分量进行了计算和合成,最后给出了硅钢中硅含量测定结果的不确定度报告:该硅钢中的硅含量(质量分数)为1.50%,扩展不确定度U=0.20%,取包含因子k=2。 According to GB/T 15616-2008\"Quantitative Method for Electron Prohe Microanalysis of Metals and Alloys\",the quantitative results of Si content in some W600 silicon steel was measured hy EPMA-WDS.The uncertainty components which might affect the measurement results were considered,calculated and synthesized. Finally the uncertainty result for the quantitative value of Si content in the silicon steel was got.The mass content of Si was 1.50%,and expanded uncertainty U=0.20%under the condition of co... 
2011-06-28 171 5.8

变压器D21硅钢铁芯片采用冲压工艺生产。首先对其工艺进行了分析,确定了冲压方案。对产品进行了排样设计,计算了冲压力,确定了压力中心。然后,设计了单工序落料模具,完成了模具装配图。 D21 silicon steel chips for transformer are produced by stamping.First,its stamping process was analyzed and the scheme of the stamping process was determined.The product layout was designed,the punching pressure was calculated,the pressure center was determined.Then,the blanking die with single procedure was designed,the die assembly drawing was completed. 
2013-07-28 124 5.8

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