钢厂
CGO硅钢各阶段织构遗传继承性的EBSD分析
利用EBSD技术对CGO硅钢热轧、中间退火、脱碳退火及二次再结晶退火组织及织构进行分析,研究了CGO硅钢各阶段加工制备过程中高斯{110}<001>晶粒的形状、尺寸及分布特点,分析了高斯取向晶粒在各工序过程中的遗传继承性特点。结果表明,CGO硅钢热轧板的次表层存在Goss取向晶粒,历经一次冷轧及中间退火后Goss取向晶粒基本消失,一次再结晶之后Goss织构仍不是主要织构,主要织构为{111}<110>和{111}<112>,说明Goss取向晶粒在二次再结晶退火前数量及尺寸上并不占优势,二次再结晶过程中Goss取向晶粒异常长大形成锋锐Goss织构。{111}<110>和{111}<112>织构组分的强度在一次冷轧中不断增加,{111}<112>织构组分的强度在二次冷轧后达到最大而{111}<110>织构组分是在初次再结晶后变强。 Grain shape,size and distribution of { 110} < 001 > Goss grains in CGO steel and the hereditary characteristics of Goss orientated grains during each processing period were investigated,based on the analysis of the microstructure and texture of the CGO silicon steel during hot rolling,intermediate annealing,decarburizing annealing and secondary recrystallization annealing by means of EBSD. The results show that Goss orientated grains exist in the subsurface of the hot rolled plate,and Goss...
高Cu无取向电工钢的制备
运用EBSD和光学显微镜,研究了0.25%~0.45%Cu对无取向电工钢热轧板显微组织,成品板显微组织、织构和磁性能的影响。实验结果表明:卷取过程中Cu元素在热轧板表层的偏聚作用显著阻碍了热轧板表层再结晶晶粒长大,导致热轧板表层晶粒尺寸随着Cu含量增加而逐渐较小,但热轧板中间晶粒尺寸变化不大。同时发现Cu元素能够明显改善织构类型,使有利织构组分增加,不利织构组分减少,同时减弱织构强度。从实验结果可知0.35%Cu能够显著改善电工钢的磁性能,铁损P15/50最低达到4.1 W/kg,磁感B50最高值达到1.8 T。 Effects of high content Cu on microstructure of hot rolled plates and microstructure,texture and magnetic properties of annealed finish product plates of non-oriented electrical steel were examined by means of EBSD technique and optical microscope. The results show that surface segregation of Cu significantly hindered recrystallized grain growth of surface layer in hot rolled plate during the coiling,as a result,the surface grain sizes of the hot-rohed plates decrease with the increase of Cu con...
硅钢50A1300的流变应力和临界动态再结晶行为
用Gleeble1500D模拟试验机在变形温度为950~1 200℃、应变速率为0.01~8s-1、最大变形程度为60%的条件下,对硅钢50A1300做单道次压缩试验,首先分析了不同参数对流变应力的影响,然后用回归法确定了应力模型中的变形激活能及材料常数,得到硅钢50A1300在峰值应力条件和稳态应力条件下的变形激活能分别为270.360和91.557kJ/mol,同时得到了流变峰值应力模型,模型的相关系数为0.997。最后通过作lnθ-ε图的方法找到了硅钢50A1300发生动态再结晶的临界应变量,并回归得到峰值应变量、临界应变量与参数Z/C的关系式。 To analyze the effects of different parameters on the flow stress and critical strain of the dynamic recrystallization,single-pass compression experiments were carried out with silicon steel 50A1300 specimens using a Gleeble1500D thermal simulator at a temperature range of 950-1 200 ℃ and strain rate range of 0.01-8 s-1 under the condition of maximum deformation of 60%.The average deformation activation energy is respectively 270.360 and 91.557 kJ/mol under the peak stress and steady-state stres...

