钢厂
高硅钢薄板退火过程中的织构演变
采用传统的轧制和退火工艺制备了0.30mm厚的6.5%(质量分数)Si高硅电工钢薄板,采用X射线衍射技术对退火过程中的再结晶织构进行了研究。冷轧高硅钢薄板700℃退火形成以{111}〈112〉为峰值的γ织构(〈111〉∥ND)和以{001}〈210〉为峰值的{001}织构;而900℃以上温度退火则形成强{001}〈210〉织构。进一步的研究表明是在晶粒长大过程中{001}〈210〉发展成为主要再结晶织构组分。 High silicon steel thin sheets with thickness of 0.3mm were successfully produced by conventional rolling and annealing methods.Recrystallization texture was investigated by means of X-ray diffraction.It is found that recrystallization texture is mainly composed of γ fiber(〈111〉∥ND)with peak at {111}〈112〉 and {001} fiber with peak at {001}〈210〉 after annealing at 700℃,while strong {001}〈210〉 component dominates recrystallization texture after annealing above 900℃.It is during grain growth that {...
基于GTN损伤模型对含边部缺陷硅钢薄板冷轧时边裂的预测
采用拉伸试验和显微组织观测的方法确定了GTN损伤模型中的9个损伤参数,运用GTN损伤模型对冷轧硅钢薄板边部缺陷的扩展及边裂的产生进行了有限元模拟,并与预置缺口的钢板轧制试验进行对比。结果表明:轧制过程中边部缺陷是造成钢板边部裂纹萌生和扩展的一个重要原因,GTN损伤模型可用来预测含边部缺陷硅钢薄板在冷轧过程中边裂的产生;预测结果与试验结果基本一致。 The crack initiation and propagation of silicon steel strip with edge defect during cold rolling process was studied by using GTN damage model in this paper.Nine damage parameters in GTN model were identified by tensile testing and microstructure observing,and then the FE simulation of edge defect evolution of silicon steel strip during rolling process was conducted on the base of GTN damage model,and then the results were compared with rolling experimental results.The results show that the edge...
无取向硅钢晶粒长大过程中应力对织构和晶界变化的影响
采用EBSD技术研究了有、无拉应力作用下无取向硅钢在晶粒长大过程中织构转变及晶界变化的规律。结果表明:在晶粒生长期间,无应力作用下的硅钢中,{111}〈112〉,{111}〈110〉织构组分强化,而{100}〈001〉织构组分弱化;与无拉应力作用下的情况相比,施加5MPa的拉应力时,{111}〈112〉,{111}〈110〉织构组分强化的速率下降,{100}〈001〉织构组分变化不明显。对于在晶粒生长期间持续变化的{111}〈112〉,{111}〈110〉和{100}〈001〉织构组分而言,虽然有、无拉应力作用下硅钢的{111}〈112〉和{111}〈110〉织构组分的高取向差角度晶界频率均下降,而{100}〈001〉织构组分的高取向差角度晶界频率则上升,但当有拉应力作用后,{111}〈112〉和{111}〈110〉织构组分的高取向差角度晶界频率下降的速率变小,{100}〈001〉织构组分的高取向差角度晶界频率上升的速率稍有变小。通过对无取向硅钢在晶粒长大过程中织构转变及晶界变化规律的研究,分析了合金原子在晶界的偏聚行为。 The rules of texture and grain boundary transformation in the nonoriented silicon steel under applied stress or without applied stress during grain growth were investigated by EBSD.The results show that the {111}〈112〉 and {111}〈110〉 components in the nonoriented silicon steel without stress are strengthened during grain growth whereas {100}〈001〉 component is weakened,but the growth rate of {111}〈112〉 and {111}〈110〉 component decreases,while the area fraction of {100}〈001〉 component doesn’t chang...
退火温度对双辊连铸无取向硅钢组织的影响
利用光学显微镜、TEM和EBSD研究了退火温度对双辊连铸无取向硅钢再结晶组织的影响。结果表明,900℃退火后组织分布不均匀,有大量带状组织,平均晶粒尺寸29.5μm。提高退火温度,晶粒尺寸增大,组织均匀化程度增加,1050℃退火时,带状组织基本消失,平均晶粒尺寸42.2μm。 Effect of annealing temperature on recrystallization microstructure of non-oriented electrical steel produced by twin-roll casting process was investigated using OM,TEM and EBSD.The results show that the recrystallization microstructure is uneven because of many banded grains existing,average grain size is 29.5 μm.With annealing temperature increasing,the recrystallization grain size increases,microstructure becomes more homogeneous.When 1050 ℃ annealing,the banded structure almost disappear and...
温度及扩散时间对CVD法制备高硅钢的影响
采用CVD法制备6.5%Si高硅钢,介绍了具体的制备工艺过程,研究了温度对渗硅速率和试样质量减轻的影响,同时分析了扩散时间对高硅钢中硅分布的影响。结果表明:在CVD反应过程中,反应温度高于1050℃将大大提高渗硅速率,但当温度大于1200℃后,渗硅速率趋于稳定;渗硅后,试样会减轻、减薄,随着温度升高,试样质量减轻的速率逐渐增大,在1200℃左右趋于稳定;扩散时间越长,硅分布越均匀,结合制备效率进行考虑,满足Δw表-中/b≤5的时间为适宜的扩散时间。 6.5%Si high silicon steel was manufactured by using CVD method and the process was introduced,the influence of temperature on the siliconizing rate and quality reducing rate,diffusion time on silicon distribution were investigated.Results as follows: the siliconizing rate will increase quickly when the temperature is higher than 1050 ℃,but the siliconizing rate will become steadily as the temperature up to 1200 ℃;The quality reducing rate will increase with the elevating of temperature and the r...
无取向电工钢环保绝缘处理液试验研究
针对目前大部分无取向电工钢处理液为含铬处理液、且需在较高温度下固化的情况,在分析成膜物质性质的基础上,试验研究了一种可低温快速固化的电工钢环保绝缘处理液,研究了其涂装工艺,并测定了涂层的附着性、绝缘性、耐热性、耐蚀性等性能。试验结果表明:该处理液可在150~250℃下快速烘干固化,涂层表面光滑且致密均匀,性能优良,可满足中小电机的使用要求。 At present,most of the insulating fluid for non-oriented electrical steel contains chromium,and should be cured at high temperature.On the basis of analyzing the characteristics of the film-forming substance,a kind of eco-friendly insulating fluid with lower curing temperature for non-oriented electrical steel sheet was developed in the experiments.Then its coating process was studied,and the adhesiveness,insulativity,heat resistance,corrosion resistance and other properties of the coating was m...
铬、锰及退火温度对无取向硅钢组织性能影响
为探究铬、锰元素及退火温度对高强无取向硅钢性能的影响规律,借助OM、SEM、EBSD与万能拉伸试验机等分析不同制造工艺下3组不同含量铬、锰元素的无取向硅钢热轧、常化及退火处理后组织与性能。结果表明,试验钢热轧后组织不均匀,心部为沿轧向分布纤维状组织,边部为少量再结晶晶粒,常化处理能显著改善热轧板组织均匀性,消除热轧板中心部位的纤维状组织。经冷轧及退火后得到多边形铁素体晶粒,其中960℃退火,晶粒尺寸偏大,有利织构{100}组分体积分数减少,不利织构{111}组分体积分数增加,成分为0.2Mn-1Cr的1号试验钢960℃退火后铁损最大,磁感强度偏小;成分为0.5Mn-1Cr的2号试验钢930℃退火后,磁性能与强度等综合性能最佳,工频铁损P1.5/50为2.41W/kg,高频铁损P1.0/400为17.36W/kg,磁感应强度B5 000为1.638T,抗拉强度为685MPa。 In order to study the effect of Cr,Mn and annealing temperature on the properties of high-strength non-oriented silicon steel,the microstructure and properties of three groups of non-oriented silicon steel with different Cr,Mn content under different manufacturing processes were analyzed by means of OM,SEM,EBSD and universal tensile tester.The results show that the structure of experimental steel is not uniform after hot rolling,and the core is distributed in fibrous structure along the rolling ...
铸坯热装温度对无取向硅钢中AlN和MnS析出行为的影响
通过固溶度积公式计算及热模拟实验,对不同热装和加热温度条件下的无取向硅钢铸坯中析出相进行了研究.在低于950℃热装时,铸坯中AlN的析出量和尺寸不再变化,但MnS和AlN-MnS的数量及平均尺寸随着热装温度降低而进一步增加,并在温度低于600℃时达到最大值后保持不变.与1200℃相比,1100℃加热的铸坯中AlN、MnS的总固溶量相对更少.相比850℃热装,600℃热装再加热到1100℃的铸坯中AlN和MnS的总固溶量更少,且AlN和MnS尺寸更大.合适的热装温度和加热温度分别为600℃和1100℃. Based on solubility product calculation and thermal simulation experiments,precipitated phases in continuous casting slabs of non-oriented silicon steel were systematically studied at different hot charging and heating temperatures.When the hot charging temperature is below 950 ℃,the content and size of AlN remain unchanged,but the quantity and size of MnS and AlN-MnS increase when the hot charging temperature decreases,reach maximum and remain unchanged when the hot charging temperature is belo...
