钢厂
高Si电工钢铁芯的MA-SPS制备工艺和磁性能研究
以一种新的Fe-Si合金制备工艺为出发点,研究了不同放电等离子体快速烧结工艺(SPS)和Si含量变化对Fe-Si合金材料显微组织与磁性能的影响。结果表明,在烧结温度为1 000℃时制备的Fe-6.5%Si合金(质量分数,下同)的综合磁性能较好,其在50Hz下的铁损为0.549W/kg,最大磁感应强度为0.124 3T,矫顽力245.6 A/m,磁导率0.338mH/m。另外,材料的最大磁感应强度随Si含量的增加显著增长,1 000Hz下,Fe-10.0%Si的最大磁感应强度可达到Fe-6.5%Si合金的5倍左右。 The effects of Si content and SPS technology on microstructure and magnetic properties of Fe-Si alloy material were studied in the paper.It shows that the magnetic properties are the best when the content of Si is 6.5wt% and the sintering temperature is 1 000℃,the iron loss is 0.549W / kg in 50Hz,maximum magnetic induction is 0.124 3T,coercive force is 245.6A / m and permeability is 0.338mH / m。And,the maximum magnetic induction increases significantly with the increase of Si.The maximum magneti...
修正GTN模型及其在预测硅钢冷轧边裂中的应用
考虑剪应变对微孔洞损伤演化的影响,对GTN损伤模型的损伤演化机制进行修正,建立了适用于不同应力三轴度水平的损伤模型。结合隐式应力更新算法和显式有限元计算,采用VUMAT子程序实现了修正GTN模型在有限元软件ABAQUS中的数值计算。通过模拟纯剪切和剪切-拉伸两组试样的损伤演化和断裂行为,验证了修正GTN模型在不同应力三轴度承载条件下的有效性。运用修正GTN损伤模型模拟含边部缺口的带钢在轧制过程中裂纹的萌生和扩展行为,模拟结果与实验相一致,表明该模型可有效地用于带钢缺陷在轧制过程中扩展行为的分析和预测。模拟和实验结果表明,带钢边部缺口在轧制过程中,缺口前沿和后沿均会萌生裂纹,且后沿裂纹扩展更为明显。 Considering the effect of shear strain of micro-void on damage evolution, a modified GTN model applicable to various stress triaxiality conditions is proposed by modifying the damage evolution mechanism of the GTN damage model. The modified model is implemented in commercial finite element software ABAQUS by combining the implicit stress update method with an explicit finite element solving algorithm and through the user-defined material subroutine VUMAT. The damage evolution and the failure pro...
无取向硅钢钙处理前后夹杂物的行为研究
研究了无取向硅钢钙处理前后夹杂物的行为,重点考察了钙处理前后夹杂物的成分、类型、形貌和尺寸研究的变化情况,为实际生产中无取向硅钢的钙处理提供理论指导。试验发现:钙处理前夹杂物主要以Al2O3、Al2O3-MgO为主,且在夹杂物表面有AlN析出,钙处理后夹杂物以Al2O3-MgO-CaS-CaO系复合夹杂物为主,还含有少量的SiO2或AlN;钙处理前后,夹杂物形貌由多边形或不规则形逐渐向球形或近似球形转变,并且夹杂物尺寸不断增大;钙处理前后,含钙夹杂物的比例发生突变,由10%增大到74.5%,且随着钙处理时间的延长,含钙夹杂物比例下降,表明钙处理使夹杂物变性后易聚集长大并上浮去除。 Behavior of inclusions before and after calcium treatment in non-oriented silicon steel was researched by investigating changes of compositions,types,shapes and sizes of inclusions before and after calcium treatment,for the purpose of providing theoretical guidance for calcium treatment of non-oriented silicon steel in actual situation. Results indicated that Al2O3 and Al2O3-MgO were main types of inclusions before calcium treatment,sometimes AlN maybe precipitate in the outer of inclusions. Al2...
国产化高牌号无取向硅钢退火、涂层炉新技术
从影响高牌号无取向硅钢退火工艺的主要参数入手,介绍高牌号无取向硅钢退火炉在加热、气氛控制、冷却、涂层烘烤方面的新技术,并展望无取向硅钢退火炉的发展方向。 Based on the technology parameters of high-grade non-oriented silicon steel annealing,the new technology of the annealing line,which includes heating,atmosphere control,cooling,coating baking,is introduced,and the development direction of non-oriented silicon steel annealing furnace is pointed out.
加热温度对W470高硅钢连铸坯氧化铁皮的影响
采用SEM、EDS和XRD对不同加热温度下W470连铸坯氧化铁皮的微观形貌及相结构进行研究。结果表明,W470氧化铁皮难以除去的原因是氧化铁皮熔化,液相包裹着FeO,凝固时发生共晶反应,生成FeO/Fe2SiO4共晶混合物,并深嵌入基体。降低加热炉的加热温度,使连铸坯全程在FeO/Fe2SiO4共晶混合物熔点(1177℃)以下加热,可降低氧化铁皮与基体的结合力,能够有效解决W470除鳞困难问题。 The microstructure and phase structure of iron scale of W470 continuous casting billet at different heating temperatures were investigated by SEM,EDS,and XRD.The results show that the reason why the iron scale of W470 removes hardly is that iron scale is melted and the FeO is surrounded by the liquid phase,which forms FeO / Fe2SiO4eutectic mixture and is embedded into the matrix after solidification.Lowering the heating temperature and keeping the continuous casting billet heating under the melt...
二次冷轧压下率对高牌号无取向硅钢组织结构和磁性能的影响
研究二次冷轧压下率对于硅的质量分数为3.0%的无取向硅钢组织结构和磁性能的影响。结果表明:当第二次冷轧压下率从0变化至16.7%时,铁损逐渐增加,磁感逐渐降低。当第二次冷轧压下率大于16.7%时,随压下率的增加,铁损逐渐减小,磁感逐渐增加。当第二次冷轧压下率大于38%时,二次冷轧法所能获得的磁性能明显优于一次冷轧法。 Effect of double cold reduction on magnetic,microstructure and texture of 3.0% Si non-oriented silicon steel sheets was investigated.The results show that the iron loss increases and magnetic induction reduces as the percentage redcution in secondary cold rolling changes from 0 to 16.7%.The core loss can be reduced remarkably,and magnetic induction can get a little benefit if the percentage redcution in double cold reduction is higher 16.7%.In case of higher than 38% of the percentage redcution ...
无取向电工钢环保绝缘处理液试验研究
针对目前大部分无取向电工钢处理液为含铬处理液、且需在较高温度下固化的情况,在分析成膜物质性质的基础上,试验研究了一种可低温快速固化的电工钢环保绝缘处理液,研究了其涂装工艺,并测定了涂层的附着性、绝缘性、耐热性、耐蚀性等性能。试验结果表明:该处理液可在150~250℃下快速烘干固化,涂层表面光滑且致密均匀,性能优良,可满足中小电机的使用要求。 At present,most of the insulating fluid for non-oriented electrical steel contains chromium,and should be cured at high temperature.On the basis of analyzing the characteristics of the film-forming substance,a kind of eco-friendly insulating fluid with lower curing temperature for non-oriented electrical steel sheet was developed in the experiments.Then its coating process was studied,and the adhesiveness,insulativity,heat resistance,corrosion resistance and other properties of the coating was m...
硅钢芯片冲裁工艺分析与对策
分析了冲裁硅钢芯片时出现的质量问题,针对影响硅钢芯片冲裁质量的4大因素——人、原材料状态、工艺和工装进行了工艺试验和分析,根据原材料状态的差异,采用不同工艺方案,特别是如何合理选择冲裁模具间隙,解决了硅钢芯片冲裁时产生的主要质量问题,使冲裁的硅钢芯片达到最佳质量状态,并满足硅钢芯片的使用性能。 The problems occurred during silicon steel chip punching and the factors that affect the quality of silicon steel chip punching were analyzed,the factors include 4aspects,that is,people,raw material status,process and frock,at the same time,process tests and analysis aimed at the factors that affect punching quality were did,according to the difference of raw material status,corresponding process schedules wee taken,especially in how to reasonably select punching dies clearance,which solved the ...
温度及扩散时间对CVD法制备高硅钢的影响
采用CVD法制备6.5%Si高硅钢,介绍了具体的制备工艺过程,研究了温度对渗硅速率和试样质量减轻的影响,同时分析了扩散时间对高硅钢中硅分布的影响。结果表明:在CVD反应过程中,反应温度高于1050℃将大大提高渗硅速率,但当温度大于1200℃后,渗硅速率趋于稳定;渗硅后,试样会减轻、减薄,随着温度升高,试样质量减轻的速率逐渐增大,在1200℃左右趋于稳定;扩散时间越长,硅分布越均匀,结合制备效率进行考虑,满足Δw表-中/b≤5的时间为适宜的扩散时间。 6.5%Si high silicon steel was manufactured by using CVD method and the process was introduced,the influence of temperature on the siliconizing rate and quality reducing rate,diffusion time on silicon distribution were investigated.Results as follows: the siliconizing rate will increase quickly when the temperature is higher than 1050 ℃,but the siliconizing rate will become steadily as the temperature up to 1200 ℃;The quality reducing rate will increase with the elevating of temperature and the r...

