硅钢资料

运用EBSD和光学显微镜,研究了0.25%~0.45%Cu对无取向电工钢热轧板显微组织,成品板显微组织、织构和磁性能的影响。实验结果表明:卷取过程中Cu元素在热轧板表层的偏聚作用显著阻碍了热轧板表层再结晶晶粒长大,导致热轧板表层晶粒尺寸随着Cu含量增加而逐渐较小,但热轧板中间晶粒尺寸变化不大。同时发现Cu元素能够明显改善织构类型,使有利织构组分增加,不利织构组分减少,同时减弱织构强度。从实验结果可知0.35%Cu能够显著改善电工钢的磁性能,铁损P15/50最低达到4.1 W/kg,磁感B50最高值达到1.8 T。 Effects of high content Cu on microstructure of hot rolled plates and microstructure,texture and magnetic properties of annealed finish product plates of non-oriented electrical steel were examined by means of EBSD technique and optical microscope. The results show that surface segregation of Cu significantly hindered recrystallized grain growth of surface layer in hot rolled plate during the coiling,as a result,the surface grain sizes of the hot-rohed plates decrease with the increase of Cu con... 

利用EBSD技术对CGO硅钢热轧、中间退火、脱碳退火及二次再结晶退火组织及织构进行分析,研究了CGO硅钢各阶段加工制备过程中高斯{110}<001>晶粒的形状、尺寸及分布特点,分析了高斯取向晶粒在各工序过程中的遗传继承性特点。结果表明,CGO硅钢热轧板的次表层存在Goss取向晶粒,历经一次冷轧及中间退火后Goss取向晶粒基本消失,一次再结晶之后Goss织构仍不是主要织构,主要织构为{111}<110>和{111}<112>,说明Goss取向晶粒在二次再结晶退火前数量及尺寸上并不占优势,二次再结晶过程中Goss取向晶粒异常长大形成锋锐Goss织构。{111}<110>和{111}<112>织构组分的强度在一次冷轧中不断增加,{111}<112>织构组分的强度在二次冷轧后达到最大而{111}<110>织构组分是在初次再结晶后变强。 Grain shape,size and distribution of { 110} < 001 > Goss grains in CGO steel and the hereditary characteristics of Goss orientated grains during each processing period were investigated,based on the analysis of the microstructure and texture of the CGO silicon steel during hot rolling,intermediate annealing,decarburizing annealing and secondary recrystallization annealing by means of EBSD. The results show that Goss orientated grains exist in the subsurface of the hot rolled plate,and Goss... 

研究了退火温度对3.1%Si无取向硅钢组织和磁性能的影响规律。结果表明:退火温度从940℃提高至1 000℃,平均晶粒尺寸由98μm增加到145μm,铁损P_1.5/50从2.576 W/kg降低至2.408W/kg。随着退火温度的升高,γ不利织构组分强度逐渐降低,{111}〈112〉织构组分强度降低约16%,磁感B₅₀逐渐升高,磁性能水平提高。 The effects of annealing temperature on microstructure and texture and magnetic properties of 3.1%Si non-oriented silicon steel were investigated in this paper.The results showed that,when the annealing temperature increased from 940℃ to 1 000℃,the average grain size of metallographic structure increased from 98μm to 145μm,the iron loss value P_1.5/50 decreased from2.576 W/kg to 2.408 W/kg.And as the annealing temperature increased,the strength of the unfavorable texture componentγgrad... 

【摘要】 <正>2012年3月29日中国钢铁工业协会在上...

通过制备磷酸二氢铝硅钢涂层,研究了氧化锌对无铬涂层耐盐雾性能、电化学性能和附着性的影响。结果表明,硅钢表面涂层含有4.0%的氧化锌时,涂层具有最高的耐腐蚀性能和电化学性能,而且其致密表面最为平整,没有裂纹出现。 The effects of ZnO on the salt spray resistance property, electrochemical performance and adhesiveness of silicon steel insulating coating were studied. The results show that the best corrosion resistance and electrochemical properties can be obtained when the coating contains 4.0% oxide zinc, and the dense surface is smooth without cracks. 

运用电子背散射衍射(EBSD)技术,研究了50W600无取向硅钢在热轧→冷轧→退火工序间织构的演变。结果表明:由于热轧板沿板厚方向的应力场和温度场存在差异,导致热轧板不同层织构类型和强度存在差异;热轧板表层主要存在铜型、黄铜和高斯织构,1/4层织构主要为α纤维织构和较弱的高斯织构,中心层织构较单一,主要为α纤维织构;和热轧板相比,冷轧板各层织构差异较小,为典型的轧制织构(α纤维织构和γ纤维织构);退火板各层都表现为γ纤维织构增强、α纤维织构减弱,旋转立方织构基本消失。 The texture evolution of 50W600non-oriented silicon steel in hot rolling,cold rolling and annealing process was investigated by electron back-scatter diffraction(EBSD)technology.Results show that the hot rolled plate texture types and intensities along thickness direction were different because of the different stress fields and temperature fields.The major texture types in the surface of hot rolled plate were copper,brass and Gauss texture.The texture was composed ofαfibre texture and weaker Ga... 

【摘要】 <正>由西电集团、保定天威集团使用迁钢公...

分析了冲裁硅钢芯片时出现的质量问题,针对影响硅钢芯片冲裁质量的4大因素——人、原材料状态、工艺和工装进行了工艺试验和分析,根据原材料状态的差异,采用不同工艺方案,特别是如何合理选择冲裁模具间隙,解决了硅钢芯片冲裁时产生的主要质量问题,使冲裁的硅钢芯片达到最佳质量状态,并满足硅钢芯片的使用性能。 The problems occurred during silicon steel chip punching and the factors that affect the quality of silicon steel chip punching were analyzed,the factors include 4aspects,that is,people,raw material status,process and frock,at the same time,process tests and analysis aimed at the factors that affect punching quality were did,according to the difference of raw material status,corresponding process schedules wee taken,especially in how to reasonably select punching dies clearance,which solved the ... 

简述了无取向硅钢环保涂层发展背景,分析了硅钢环保涂层的特点及国内、外研究进展,提出了硅钢保涂层下一步的发展方向。 The back ground of environmental protection coating of non-oriented silicon steel was described in this paper.The characteristics and study progress in domestic and foreign of environmental protection coating of non-oriented silicon steel were analysised.The next development direction of environmental protection coating of non-oriented silicon steel was put forward. 

利用OM、TEM与EDS技术,对Fe-3.2%Si低温取向硅钢热轧板进行不同常化冷却工艺处理后的显微组织、析出相及最终产品的磁性能进行分析,并与热轧板的组织和析出相进行对比。结果表明,常化板较热轧板的表层组织均匀,基体中再结晶比例增加,带状组织变窄;常化板中析出物的数量明显比热轧板的多,析出物主要有AlN、MnS及复合析出的(Cu,Mn)S等。在常化温度1120℃、保温3 min的条件下,采用二段式冷却较空冷、淬沸水、淬常温水的冷却工艺,常化板表层显微组织更均匀,沿板厚方向的显微组织的不均匀性显著,取向硅钢的磁性能最高;常化后采用二段式冷却工艺析出的细小析出物数量最多,且弥散分布在基体中,抑制剂的抑制效果最好,对成品获得高磁性最有利。 Microstructure, precipitate and magnetic characteristic of final products with different normalizing cooling processes for Fe-3.2%Si low-temperature hot-rolled grain-oriented silicon steel were analyzed and compared with the hot-rolled plate by optical microscopy(OM), transmission electron microscopy(TEM), and energy dispersive spectrometry(EDS). The results show that, the surface microstructure is uniform, the proportion of recrystallization in matrix increases, and the banding textures are nar... 

【作者】 程志明； ...

作为一种具有优异高频铁磁性能的合金,Fe-6.5%Si(质量分数)高硅钢在高频工况条件下降损效果明显,对电气行业应用器件高频化、小型化、节能等具有十分重要的意义。通过与取向硅钢测量B-P数据对比,验证了高硅钢高频超低损特性,且轧制高硅钢与日本CVD法生产高硅钢存在基本相同的铁损值。采用国标Epstein Square法对0.30mm高硅钢薄板进行单片测试,并对由0.30mm高硅钢薄板首次装配成的电感器进行铁损测试,对比测试结果表明,元件测试与单片测试数据基本吻合,高磁感应强度条件下,元件测试结果略低于单片测试,分析原因为:线圈引起励磁压降;元件叠片间出现短路,电流增大,损耗增加;气隙板厚度过大。 As one core material with excellent high-frequency ferromagnetism,Fe-6.5%Si performs obviously reduction on core loss in high field frequency which means much to high frequency,minimization,energy conservation in electric industry.Super low loss was verified by drawing B-P curves based on detected experimental data,and which went equal to Fe-6.5%Si thin strip fabricated by CVD in Japan.Fe-6.5%Si was firstly fabricated as inductor in this research,and its core loss was determined for comparison w...