钢厂
高牌号无取向电工钢技术发展及应用
对高牌号无取向电工钢国内生产情况、工艺技术、产品性能及应用领域等进行了阐述,并探讨了高牌号无取向电工钢产品的发展趋势。 This paper introduces basic facts on the production status,process technology and products’ properties and their applications of non-oriented electrical steel with high grade at home,and then discusses the development trend on technology for producing the non-oriented electrical steel with high grade.
EB5325涂层液在冷轧无取向电工钢中的应用
介绍了EB5325涂层液的主要性能和中冶新材生产冷轧无取向电工钢所用的涂层设备,通过多次试验摸索出使用EB5325涂层液的工艺,对涂层出现的缺陷进行分析研究,并提出解决方法,使中冶新材生产的冷轧无取向电工钢的涂层质量满足了用户的要求。 This article introduces the main properties of EB5325 and the coating equipments for cold-rolled non-oriented electrical steel. A process using EB5325 coating liquid is made through many time experiments and exploration. The appeared defects in the coating are studied and analyzed,and the solutions are proposed. The coating quality meets clients’ requirements of cold rolled non-oriented electrical steel.
脱碳温度和脱碳时间对CGO取向硅钢碳含量控制的试验研究
通过测试取向硅钢不同工艺条件下的碳含量,探讨了CGO取向硅钢碳含量控制的最优处理条件,研究了脱碳温度和脱碳时间对相同初始碳含量取向硅钢的脱碳效果的影响。结果表明,在气氛为(15%~20%)H2+(75%~80%)N2,炉压差为10~20 Pa的条件下,CGO取向硅钢合适的脱碳温度为1 073 K~1 123 K,脱碳时间为10~20 min。在该处理条件下,能取得较好的脱碳效果。 By means of testing carbon content of oriented silicon steel below the distinct technical conditions,inquires the excellent handle terms of carbon content controlling for CGO oriented silicon steel,studies effects of decarburization annealing temperature and decarburization annealing time to the oriented silicon steel decarburization efficiency in same initial carbon content.The results show that,under the condition of atmosphere(15% ~ 20%) H2+(75% ~ 80%)N2 and furnace pressure difference 10 ~ 2...
陶瓷辊除瘤方法在瑞致电工钢的应用
针对陶瓷辊表面结瘤清除时间长、清除效果差等缺陷,研究正反转陶瓷辊除瘤法,以缩短除瘤时间,增强除瘤效果。 The general removal of ceramic roller surface tumor costs a long time and the effect is poor.This paper probed into the ceramic roller tumor removal in order to shorten time and enhance the effect of eliminating.
PDSOFT在硅钢退火炉管道设计中的应用
结合硅钢退火炉项目中应用PDSOFT软件进行三维配管设计的案例,描述PDSOFT软件的应用过程,总结其使用要点,分析其优缺点,并提出了推广三维设计软件的思路,对今后PDSOFT在相似项目中的推广应用有参考和借鉴价值。 Combining the case of using PDSOFT software to design the three-dimensional piping,the application process of the PDSOFT software is described,the using points are summarized,the advantages and disadvantages are analyzed,and the ideas of promoting the three-dimensional design software are put forward,which have a strong reference value for the promotion and application of PDSOFT in similar projects in the future.
电感耦合等离子体质谱法测定硅钢中痕量铜和镍
研究了应用电感耦合等离子体质谱法(ICP-MS)测定硅钢中痕量铜和镍的分析方法。采用硝酸分解样品,通过内标校正和基体匹配消除了基体干扰的影响,同时根据测量时存在的质谱干扰情况,选择同位素65Cu和60Ni作为测定元素和通过调节仪器参数使双电荷离子的产率最低,以减少带来的干扰。该方法用于硅钢中痕量铜和镍的测定,所得的结果与ICP-AES法测定结果完全吻合,各元素测定结果的RSD值小于5%,加标回收率为97.3%～100.3%。 A method for the determination trace copper and nickel in silicon steel by inductively coupled plasma mass spectrometry(ICP-MS) was studied.The samples were dissolved in HNO3.The effect of matrix interference was eliminated by internal standard correction and matrix matching.Meanwhile,according to the mass spectral interferences in determination,the isotopes including 65Cu and 60Ni were used as measuring elements.The yield of double-charge ions were minimized by adjusting instrumental parameters...
Si在纯Fe及低硅钢中扩散行为
采用磁控溅射方法,分别在纯Fe以及低硅钢基片上沉积富Si膜,并对其进行真空扩散热处理.通过能谱分析及X射线衍射研究了Si在纯Fe与低硅钢基体中的扩散特征,运用DICTRA软件建立了扩散模型.研究发现Si在纯Fe基体中扩散时发生γ-Fe(Si)→α-Fe(Si)相转变,扩散速率受控于相界面的迁移.当沿截面Si含量梯度不足以驱动相界面正向迁移时,延长扩散时间会发生相界面回迁现象,最终趋于单一相内均匀化扩散过程.Si在低硅钢基体中的扩散符合Fick扩散第二定律. Si-rich films were deposited on pure iron and low-Si steel substrates by direct current magnetron sputtering,and then were subjected to vacuum annealing.The distribution characteristics of Si across Fe and low-Si steel substrates were studied by energy spectrum analysis(EDS) and X-ray diffraction(XRD).DICTRA software was used to simulate the diffusion models.It is found that the diffusion behavior of Si in the Fe substrate is from γ-Fe(Si) phase to α-Fe(Si) phase and the rate of diffusion is con...
D21硅钢芯片冲压工艺分析及模具设计
变压器D21硅钢铁芯片采用冲压工艺生产。首先对其工艺进行了分析,确定了冲压方案。对产品进行了排样设计,计算了冲压力,确定了压力中心。然后,设计了单工序落料模具,完成了模具装配图。 D21 silicon steel chips for transformer are produced by stamping.First,its stamping process was analyzed and the scheme of the stamping process was determined.The product layout was designed,the punching pressure was calculated,the pressure center was determined.Then,the blanking die with single procedure was designed,the die assembly drawing was completed.
