钢厂
压下率对取向硅钢热轧板织构的影响
采用X-射线衍射分析技术测定了取向硅钢热轧板在不同压下率下不同厚度处的织构。结果表明,在压下率低于80%的情况下,几乎所有试样的不同厚度处的织构均为旋转立方织构类型{100}<011>,但不同压下率、不同厚度处的织构强度存在很大差异;在压下率大于80%的情况下,不同试样的不同厚度处的织构类型发生了变化,其织构类型为旋转立方织构或高斯织构{011}<100>,且当织构类型为旋转立方织构时,织构强度存在很大差异,而当织构类型为高斯织构时,织构强度差异相对较小。 The texture of the grain oriented silicon steel hot rolled plate at different compressibility has been measured.The experimental results have shown that the texture of all samples at different thickness is {100}<011> when the compressibility is below 80%,and its intensity at different compressibility and thickness is difference.The texture of all samples at different thickness is variable when the compressibility is above 80%,it is {100}<011> or {011}<100>,and the intensity of ...
电脉冲对取向硅钢凝固组织的影响
对熔融态钢液进行处理,研究了电脉冲对于取向硅钢凝固组织的影响作用,利用正交试验法研究了脉冲电容、频率、处理时间和电压等脉冲参数的作用效果。结果表明:电脉冲对钢锭晶粒组织具有明显的细化作用,凝固组织的等轴晶比例大幅上升,影响等轴晶比例的最显著性因素为脉冲频率,最优正交试验参数为电容1 200μF,脉冲频率1 Hz,处理时间5 s,脉冲电压800 V。随着输入能量的增大等轴晶率先增大后减小,脉冲输入能量为某值时,等轴晶率最大,利用经典形核理论和热力学对这一现象进行了解释。 The influence of electric pulse on the solidification structure of oriented silicon steel was investigated by applying electric pulse in molten steel.The affection due to different electric pulse parameters such as electric capacity,frequency,applied time and voltage was studied by orthogonal design test.The result showed that solidification structure of oriented silicon steel could be improved by the electric pulse,and the equiaxed crystal ratio increased obviously.The most influential paramete...
常化冷却工艺对低温取向硅钢组织及析出相的影响(英文)
利用OM、TEM与EDS技术,对Fe-3.2%Si低温取向硅钢热轧板进行不同常化冷却工艺处理后的显微组织、析出相及最终产品的磁性能进行分析,并与热轧板的组织和析出相进行对比。结果表明,常化板较热轧板的表层组织均匀,基体中再结晶比例增加,带状组织变窄;常化板中析出物的数量明显比热轧板的多,析出物主要有AlN、MnS及复合析出的(Cu,Mn)S等。在常化温度1120℃、保温3 min的条件下,采用二段式冷却较空冷、淬沸水、淬常温水的冷却工艺,常化板表层显微组织更均匀,沿板厚方向的显微组织的不均匀性显著,取向硅钢的磁性能最高;常化后采用二段式冷却工艺析出的细小析出物数量最多,且弥散分布在基体中,抑制剂的抑制效果最好,对成品获得高磁性最有利。 Microstructure, precipitate and magnetic characteristic of final products with different normalizing cooling processes for Fe-3.2%Si low-temperature hot-rolled grain-oriented silicon steel were analyzed and compared with the hot-rolled plate by optical microscopy(OM), transmission electron microscopy(TEM), and energy dispersive spectrometry(EDS). The results show that, the surface microstructure is uniform, the proportion of recrystallization in matrix increases, and the banding textures are nar...
离散粒子群优化算法在硅钢涂层近红外光谱厚度检测中的应用研究
提出一种基于粒子群优化算法实现的硅钢涂层厚度近红外光谱检测新方法。首先,采用近红外光谱仪采集获得了硅钢表面绝缘涂层的近红外光谱,然后,采用离散粒子群算法筛选出近红外光谱数据的最佳波长变量并组成新的光谱数据,最后,建立涂层厚度的核偏最小二乘定量分析模型。实验显示,所建定量分析模型对检验样本分析的绝对误差范围为-0.12~0.19μm,最大相对误差为14.31%,完全符合现场检验需要。研究表明,离散粒子群算法可以有效地筛选出携带更多有用信息的波长变量,提高定量分析模型的分析准确度和速度,是一种有效的近红外光谱波长筛选方法,同时,近红外光谱法也是一种有效的硅钢绝缘涂层厚度检测方法。 A novel thickness measurement NIR spectrometry for surface insulation coating of silicon steel based on discrete binary particle swarm optimization(DBPSO) algorithm is presented.First,we used NIR spectrometer to collect the NIR spectra of insulation coating of silicon steel,and then,DBPSO algorithm was used to select the optimal wavelength variates and composed a new spectra set.Last,the authors created the thickness quantitative analysis model using kernel partial least square algorithm.The exp...
400mm硅钢自动轧制试验轧机
西安重型机械研究所为武钢开发了目前国内第一台自动化水平较高的先进可靠的硅钢热轧试验轧机。本文介绍了该轧机的工艺参数、设备组成,技术特点及轧制流程,该轧机在规定的终轧温度范围内,实现了2.5 m/s的快速轧制速度,保证了控制系统准确及时的采集到轧件进出轧辊时的信号,缩短道次间隙时间,实现了自动控制,保证了产品板形及精度的高水平要求,对于硅钢尤其是对其取向硅钢新产品、新工艺的开发具有深远意义。 An experimental prototype of 400 mm silicon steel hot rolling mill was developed by Xi’an Heavy Machinery Research Institue for Wu Gang.The technological parameters,configuration and characteristic of advanced control system in the experimental prototype are introduced in detail.The experimental prototype was realized the fast rolling of 2.5 m/s in the range of specified rolling temperature.Its automatic rolling control system can acquisite the signals that a rolled piece enters in and exits fro...
低温高磁感取向硅钢高温退火过程织构及析出物的演变行为
对低温法生产的以AlN为主抑制剂的Hi-B取向硅钢高温退火过程进行了中断实验,借助EBSD及TEM技术对高温退火连续升温过程中织构与析出物的演变进行了研究。实验结果表明,800℃时ODF图出现高斯织构组分,但强度很弱,高斯晶粒偏离角在10°以上;950~1 000℃时高斯晶粒异常长大,偏离角3~6°;高温退火过程析出物主要有球形、规则立方形及不规则多面体形3种形貌,由于渗N的影响,Zener因子先增大再减小,并且析出物在高斯晶界前沿优先粗化。 The annealing process at high temperature of Hi-B silicon steel using low slab reheat temperature and with AlN as the inhibitor has been studied by interrupting test,and the evolution of texture and precipitates during continuous heating-up in the annealing process at high temperature was analyzed by EBSD and TEM. The results showed that Goss texture appears in ODF at 800 ℃,but the intensity of Goss texture was very weak and the deviation angle was more than10°. Goss grains grow abnormally durin...
常化温度对TSCR流程制备低碳低硅无取向硅钢组织和性能的影响
在实验室试制了TSCR流程的低碳低硅无取向硅钢,研究了在850~1050℃不同温度常化对冷轧量0.5mm厚钢板再经950℃×7min退火后的组织、织构和磁性能的影响。结果表明:随常化温度的升高,使热轧板晶粒尺寸增大,晶界更清晰,组织均匀性更好;由于第二相AlN和MnS析出物尺寸比较大,使冷轧退火后钢板晶粒也随常化温度升高呈单调增大趋势;γ有利织构和{111}、{112}不利织构与常化温度升高同时增强,但前者增强更多;冷轧板退火后铁损随常化温度升高呈单调下降,磁感呈单调上升趋势。 The low-carbon and low-silicon non-oriented silicon steel was prepared by thin slab casting and rolling(TSCR) in lab.The effect of normalizing at different temperatures in 850-1 050℃on microstructure, texture and magnetic properties of 0.5 mm cold-rolled sheets after annealing at 950℃for 7 min was researched. The results show that with increasing the normalizing temperature,the grain size of hot-rolled sheets increased,the grain boundaries were more clear and the rnicrostructure uniformity was b...
EB5325涂层液在冷轧无取向电工钢中的应用
介绍了EB5325涂层液的主要性能和中冶新材生产冷轧无取向电工钢所用的涂层设备,通过多次试验摸索出使用EB5325涂层液的工艺,对涂层出现的缺陷进行分析研究,并提出解决方法,使中冶新材生产的冷轧无取向电工钢的涂层质量满足了用户的要求。 This article introduces the main properties of EB5325 and the coating equipments for cold-rolled non-oriented electrical steel. A process using EB5325 coating liquid is made through many time experiments and exploration. The appeared defects in the coating are studied and analyzed,and the solutions are proposed. The coating quality meets clients’ requirements of cold rolled non-oriented electrical steel.
硅钢芯片冲裁工艺分析与对策
分析了冲裁硅钢芯片时出现的质量问题,针对影响硅钢芯片冲裁质量的4大因素——人、原材料状态、工艺和工装进行了工艺试验和分析,根据原材料状态的差异,采用不同工艺方案,特别是如何合理选择冲裁模具间隙,解决了硅钢芯片冲裁时产生的主要质量问题,使冲裁的硅钢芯片达到最佳质量状态,并满足硅钢芯片的使用性能。 The problems occurred during silicon steel chip punching and the factors that affect the quality of silicon steel chip punching were analyzed,the factors include 4aspects,that is,people,raw material status,process and frock,at the same time,process tests and analysis aimed at the factors that affect punching quality were did,according to the difference of raw material status,corresponding process schedules wee taken,especially in how to reasonably select punching dies clearance,which solved the ...

