钢厂
普通冷轧取向硅钢中间完全脱碳退火工艺的确定
为了确定普通冷轧取向硅钢最优的中间完全脱碳退火工艺,在其一次冷轧后进行5种不同工艺的脱碳退火处理,借助扫描电镜及电子背散射衍射技术研究了不同工艺脱碳退火后的组织、织构和脱碳效果。结果表明:经5种工艺脱碳退火处理后,初次再结晶的平均晶粒尺寸均约为19μm,且不随退火温度和时间的变化而变化;经840℃×10min工艺退火后的晶粒最均匀,高斯织构位向更准确,高斯织构面积分数最多,为3.1%,可将碳脱至0.003 5%。 In order to determine the optimal intermediate complete decarburizing annealing processes for common grain-oriented(CGO)silicon steel,five kinds of intermediate decarburizing annealing processes were conducted,the microstructure,texture and decarbonization after different decarburizing annealing processes were studied by scanning electron microscopy and electro back-scattered diffraction(EBSD)technology.The results show that the average grains sizes of primary recrystallization were about 19μm a...
高强度无取向电工钢的研究进展
针对宝钢集团、日本新日铁住金和JFE公司公开的相关专利等资料,总结了国内外高强度无取向电工钢的研究进展,分析了不同电工钢的化学成分、生产工艺及产品性能,指出固溶强化、细晶强化、析出强化、位错强化都有可能被用来提高无取向电工钢的强度,并阐述了四种强化方式的优缺点;指出在高强度无取向电工钢的研发过程中,需根据其具体用途确定目标性能,再采用合适的强化手段,最终实现力学性能、磁性能和生产性能之间的平衡。 The research progress of high strength non-oriented electrical steels at home and abroad is summarized according to related patents brought into the public by Baosteel,Nippon Steel & Sumitomo Metal corporation and JFE corporation.The characteristics of chemical composition,production technology and properties of products in the patents are analyzed.Each of solution strengthening method,fine-grain strengthening method, precipitation strengthening method or dislocations strengthening method ma...
轧制法制备低铁损高磁感6.4%(质量分数)硅钢及其织构演变
采用轧制法制备出具有低铁损高磁感0.23mm厚6.4%(质量分数)Si高硅钢。沿轧制方向的最终磁性能为B8=1.474 T,B50=1.714 T;P10/50=0.30W/kg,P15/50=0.88W/kg。利用X射线衍射及背散射电子衍射(EBSD)技术分析了高硅钢在轧制及退火过程中的织构演变过程。结果表明,通过采用大压下率热轧,确保热轧板次表层中产生更多的高斯织构,随后进行遗传;温轧板中粗大的晶粒有利于冷轧剪切带的形成;冷轧板经脱碳退火后生成强{210}〈001〉织构及次表层较强的高斯织构是在轧向上获得高磁感的原因,归因于其在{111}〈112〉冷轧形变晶粒内的剪切带优先形核并长大;最终退火后虽出现了随机取向,但以{310}〈001〉织构为代表的η织构得以保留并且增强,进一步提高了磁感。随着退火温度的升高及保温时间的延长,高硅钢薄板晶粒尺寸不断增大,铁损明显降低。 6.4wt%Si high silicon steel sheets(0.23mm thick)with low iron loss and high magnetic induction were successfully produced by rolling process.The final magnetic properties along the rolling direction(RD) were:B8=1.474T,B50=1.714T;P10/50=0.30 W/kg,P15/50=0.88 W/kg.The texture evolution during rolling and annealing was investigated by means of X-ray diffraction and electron backscatter diffraction(EBSD).It was found that more Goss textures formed in the subsurface of hot rolled plates by using larg...
冷轧工艺对取向硅钢初次再结晶织构的影响
研究了取向硅钢制备过程中常见的两种冷轧工艺,主要研究了一阶段冷轧与两阶段冷轧+中间退火工艺对初次再结晶组织及织构的影响.结果表明:采用两阶段冷轧+中间退火工艺制备以Cu2S为主抑制剂的取向硅钢,其初次再结晶平均晶粒尺寸为18.1μm,高斯晶粒的体积分数为0.6%,迁移性强的重位点阵晶界(Σ5+Σ9)和高能晶界(20°~45°取向偏差角)所占比例分别为1.8%和50.4%.与一阶段冷轧工艺相比,其初次再结晶晶粒较细,且高斯晶核与特征晶界所占的比例较高,有利于高斯晶粒发生二次再结晶. Two common cold-rolling processes of grain oriented silicon steel and the effects of the single stage cold rolling and tw o-stage cold rolling w ith intermediate annealing processes on the primary recrystallization microstructure and texture w ere investigated. The results revealed that for the grain oriented silicon steel prepared under the tw o-stage cold rolling process w ith intermediate annealing w ith Cu 2 S as the main inhibitor,the average grain size of the primary recrystallization micr...
单道次热轧对Fe-1.5Si硅钢氧化层形貌的影响
将Fe-1.5Si硅钢试样分别在1 000~1 200℃空气条件下氧化30 min,观察发现在1 000℃和1 100℃时,氧化层与基体界面处存在硅酸亚铁,而当温度为1 200℃时,硅酸亚铁不但存在于界面处,同时也存在于氧化层中.将各温度下得到的带有氧化层的试样进行单道次热轧试验,压下率分别为10%和30%,发现1 000℃和1 100℃时,较高的压下率使氧化层破碎更加严重,但是单道次热轧未能改变氧化层的结构;当温度为1 200℃时,由于液态的硅酸亚铁的出现,单道次热轧能够将界面处的液化的硅酸亚铁层挤压到氧化层中,消除了硅酸亚铁层的钉扎基体的效应,改善了氧化层与基体界面的平直度. Specimens of Fe-1.5Si silicon steel were oxidized at 1 000 ~ 1 200 ℃ in air for 30 min.At 1 000 ℃ and 1 100 ℃ fayalite was observed at the scale/substrate interface.While at 1 200 ℃fayalite was found both at the scale/substrate interface and at the outer oxide layer.Then after the single-pass hot rolling process,with the compression ratio of 10% and 30%,it was found that at 1000 ℃ and 1 100 ℃,higher compression rate accelerated the broken of the scale layers,but the scale structure was not affec...
硅钢连续退火生产线设备改造
针对硅钢连续生产线设备存在的故障、隐患以及精度等影响产品质量的问题进行分析及改造,实现保证生产线设备稳定运行、提高设备精度及硅钢产品质量的目的。 This paper analyzes and transforms the electrical equipment failures, risks existed in slicon continuous production line, and the effect of accuracy to product quality, in order to ensure stable operation of equipment in production line and improve the accuracy of device, quality of silicon.
