钢厂
冲剪加工对无取向硅钢边缘组织和磁性能的影响
通过观察冲剪边缘组织,测量冲剪边缘的显微硬度、残余应力的分布情况和磁性能的变化研究了冲剪加工对无取向硅钢50WW800边缘组织和磁性能的影响。对冲剪后硅钢片进行750℃退火,分析退火对组织和磁性能的影响。结果表明,硅钢片剪切边缘会存在0.4 mm的形变硬化层,边缘应力大,铁损增加。退火后变形减小,形变硬化层变小,残余应力大幅度减少,铁损减少。 The influence of punching process on cutting edge microstructure and magnetic properties of non-oriented silicon steel 50WW800was studied by observing microstructure and measuring microhardness near cutting edge.The residual stress distribution in the silicon steel tooth and magnetic properties were measured.Effect of annealing at 750 ℃ on microstructure and magnetic properties of the silicon steel was analyzed.The results show that a cut-edge hardening layer up to 0.4 mm is observed,residual st...
压下率对取向硅钢热轧板织构的影响
采用X-射线衍射分析技术测定了取向硅钢热轧板在不同压下率下不同厚度处的织构。结果表明,在压下率低于80%的情况下,几乎所有试样的不同厚度处的织构均为旋转立方织构类型{100}<011>,但不同压下率、不同厚度处的织构强度存在很大差异;在压下率大于80%的情况下,不同试样的不同厚度处的织构类型发生了变化,其织构类型为旋转立方织构或高斯织构{011}<100>,且当织构类型为旋转立方织构时,织构强度存在很大差异,而当织构类型为高斯织构时,织构强度差异相对较小。 The texture of the grain oriented silicon steel hot rolled plate at different compressibility has been measured.The experimental results have shown that the texture of all samples at different thickness is {100}<011> when the compressibility is below 80%,and its intensity at different compressibility and thickness is difference.The texture of all samples at different thickness is variable when the compressibility is above 80%,it is {100}<011> or {011}<100>,and the intensity of ...
无取向硅钢晶粒长大过程中应力对织构和晶界变化的影响
采用EBSD技术研究了有、无拉应力作用下无取向硅钢在晶粒长大过程中织构转变及晶界变化的规律。结果表明:在晶粒生长期间,无应力作用下的硅钢中,{111}〈112〉,{111}〈110〉织构组分强化,而{100}〈001〉织构组分弱化;与无拉应力作用下的情况相比,施加5MPa的拉应力时,{111}〈112〉,{111}〈110〉织构组分强化的速率下降,{100}〈001〉织构组分变化不明显。对于在晶粒生长期间持续变化的{111}〈112〉,{111}〈110〉和{100}〈001〉织构组分而言,虽然有、无拉应力作用下硅钢的{111}〈112〉和{111}〈110〉织构组分的高取向差角度晶界频率均下降,而{100}〈001〉织构组分的高取向差角度晶界频率则上升,但当有拉应力作用后,{111}〈112〉和{111}〈110〉织构组分的高取向差角度晶界频率下降的速率变小,{100}〈001〉织构组分的高取向差角度晶界频率上升的速率稍有变小。通过对无取向硅钢在晶粒长大过程中织构转变及晶界变化规律的研究,分析了合金原子在晶界的偏聚行为。 The rules of texture and grain boundary transformation in the nonoriented silicon steel under applied stress or without applied stress during grain growth were investigated by EBSD.The results show that the {111}〈112〉 and {111}〈110〉 components in the nonoriented silicon steel without stress are strengthened during grain growth whereas {100}〈001〉 component is weakened,but the growth rate of {111}〈112〉 and {111}〈110〉 component decreases,while the area fraction of {100}〈001〉 component doesn’t chang...