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研究了应用电感耦合等离子体质谱法(ICP-MS)测定硅钢中痕量铜和镍的分析方法。采用硝酸分解样品,通过内标校正和基体匹配消除了基体干扰的影响,同时根据测量时存在的质谱干扰情况,选择同位素65Cu和60Ni作为测定元素和通过调节仪器参数使双电荷离子的产率最低,以减少带来的干扰。该方法用于硅钢中痕量铜和镍的测定,所得的结果与ICP-AES法测定结果完全吻合,各元素测定结果的RSD值小于5%,加标回收率为97.3%~100.3%。 A method for the determination trace copper and nickel in silicon steel by inductively coupled plasma mass spectrometry(ICP-MS) was studied.The samples were dissolved in HNO3.The effect of matrix interference was eliminated by internal standard correction and matrix matching.Meanwhile,according to the mass spectral interferences in determination,the isotopes including 65Cu and 60Ni were used as measuring elements.The yield of double-charge ions were minimized by adjusting instrumental parameters... 
2011-05-28 153 5.8

采用X-射线衍射分析技术测定了取向硅钢热轧板在不同压下率下不同厚度处的织构。结果表明,在压下率低于80%的情况下,几乎所有试样的不同厚度处的织构均为旋转立方织构类型{100}<011>,但不同压下率、不同厚度处的织构强度存在很大差异;在压下率大于80%的情况下,不同试样的不同厚度处的织构类型发生了变化,其织构类型为旋转立方织构或高斯织构{011}<100>,且当织构类型为旋转立方织构时,织构强度存在很大差异,而当织构类型为高斯织构时,织构强度差异相对较小。 The texture of the grain oriented silicon steel hot rolled plate at different compressibility has been measured.The experimental results have shown that the texture of all samples at different thickness is {100}<011> when the compressibility is below 80%,and its intensity at different compressibility and thickness is difference.The texture of all samples at different thickness is variable when the compressibility is above 80%,it is {100}<011> or {011}<100>,and the intensity of ... 
2011-04-28 143 5.8

采用EBSD技术研究了有、无拉应力作用下无取向硅钢在晶粒长大过程中织构转变及晶界变化的规律。结果表明:在晶粒生长期间,无应力作用下的硅钢中,{111}〈112〉,{111}〈110〉织构组分强化,而{100}〈001〉织构组分弱化;与无拉应力作用下的情况相比,施加5MPa的拉应力时,{111}〈112〉,{111}〈110〉织构组分强化的速率下降,{100}〈001〉织构组分变化不明显。对于在晶粒生长期间持续变化的{111}〈112〉,{111}〈110〉和{100}〈001〉织构组分而言,虽然有、无拉应力作用下硅钢的{111}〈112〉和{111}〈110〉织构组分的高取向差角度晶界频率均下降,而{100}〈001〉织构组分的高取向差角度晶界频率则上升,但当有拉应力作用后,{111}〈112〉和{111}〈110〉织构组分的高取向差角度晶界频率下降的速率变小,{100}〈001〉织构组分的高取向差角度晶界频率上升的速率稍有变小。通过对无取向硅钢在晶粒长大过程中织构转变及晶界变化规律的研究,分析了合金原子在晶界的偏聚行为。 The rules of texture and grain boundary transformation in the nonoriented silicon steel under applied stress or without applied stress during grain growth were investigated by EBSD.The results show that the {111}〈112〉 and {111}〈110〉 components in the nonoriented silicon steel without stress are strengthened during grain growth whereas {100}〈001〉 component is weakened,but the growth rate of {111}〈112〉 and {111}〈110〉 component decreases,while the area fraction of {100}〈001〉 component doesn’t chang... 
2012-09-28 139 5.8

【作者】 康凌晨; 王丽娜; ...
2014-05-28 119 5.8

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